Mediatek inc. (20250112108). SEMICONDUCTOR PACKAGE STRUCTURE
SEMICONDUCTOR PACKAGE STRUCTURE
Organization Name
Inventor(s)
Tai-Hao Peng of Hsinchu City TW
Yao-Tsung Huang of Hsinchu City TW
SEMICONDUCTOR PACKAGE STRUCTURE
This abstract first appeared for US patent application 20250112108 titled 'SEMICONDUCTOR PACKAGE STRUCTURE
Original Abstract Submitted
a semiconductor package structure includes a package substrate and a semiconductor die. the package substrate includes a core structure, a heat sink, and a redistribution layer. the heat sink is embedded in the core structure. the redistribution layer includes a thermal via disposed over the heat sink. the semiconductor die is disposed over the package substrate and is thermally coupled to the heat sink through the thermal via.