ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE

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ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE

This abstract first appeared for US patent application 20250070449 titled 'ANTENNA MODULE IMPLEMENTED IN MULTI-LAYERED PACKAGE

Original Abstract Submitted

an antenna module includes: a printed circuit board (pcb) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the pcb; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (rfic) chip to the array antenna portion. a second patch antenna of two patch antennas of the array antenna portion is disposed to be spaced apart from a first patch antenna and is disposed on one of the plurality of layers inside the pcb. the first patch antennas disposed on an outermost surface of the pcb are disposed in a first horizontal axis direction on the outermost surface. the second patch antennas are disposed in the first horizontal axis direction on an inner layer of the pcb.