Kabushiki kaisha toshiba (20250098191). MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kazusa Arima of Komatsu Ishikawa JP
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 20250098191 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Original Abstract Submitted
a manufacturing method a semiconductor device according to an embodiment is a manufacturing method a semiconductor device located on a semiconductor wafer within a region surrounded by a first dicing line extending in a first direction and a second dicing line perpendicular to the first direction, the semiconductor device including a cell region and a termination region, the cell region including a semiconductor device located within a semiconductor substrate, the termination region including a metal wiring line located on the semiconductor substrate and electrically connected to the semiconductor device. in this method, a stopper film is formed around the metal wiring line in the termination region, a protection film covering the metal wiring line and ending at a side surface of the stopper film is formed, and the semiconductor wafer is diced along the first dicing line and the second dicing line.