SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Organization Name

Inventor(s)

Shunsuke Kamiya of Komatsu Ishikawa (JP)

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240249987 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract consists of several components including a conductive member, a solder layer, a chip, a coating film, an insulating part, and a sealing resin. The solder layer is situated on the conductive member, the chip is placed on the solder layer, and the insulating part is located on the coating film.

The solder layer is positioned on the conductive member.
The chip is placed on the solder layer.
The coating film, which is insulative, covers the chip and includes a first covering part that protects the outer perimeter edge of the chip's upper surface.
An insulating part is situated on the coating film.
A sealing resin is used to seal the solder layer, chip, coating film, and insulating part.

Potential Applications: - This technology can be utilized in various semiconductor devices such as integrated circuits, sensors, and microprocessors. - It can also be applied in electronic components for consumer electronics, automotive systems, and industrial machinery.

Problems Solved: - Provides insulation and protection for the chip in a semiconductor device. - Ensures secure sealing of the components to prevent damage from external factors.

Benefits: - Enhances the durability and reliability of semiconductor devices. - Improves the performance and longevity of electronic systems.

Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology can be commercialized in the semiconductor industry for manufacturing high-quality electronic components with improved functionality and longevity. It can cater to a wide range of applications in various sectors such as consumer electronics, automotive, telecommunications, and industrial automation.

Questions about Semiconductor Device Technology: 1. How does the coating film contribute to the protection of the chip in the semiconductor device? The coating film acts as an insulative layer that covers the chip and includes a first covering part to safeguard the chip's outer perimeter edge, providing protection against external elements.

2. What role does the sealing resin play in the semiconductor device? The sealing resin is used to seal the solder layer, chip, coating film, and insulating part, ensuring the components are securely enclosed and protected within the device.

Original Abstract Submitted

a semiconductor device includes a conductive member, a solder layer, a chip, a coating film, an insulating part, and a sealing resin. the solder layer is located on the conductive member. the chip is located on the solder layer. the coating film is insulative. the coating film is located on the chip. the coating film includes a first covering part. the first covering part covers an outer perimeter edge of an upper surface of the chip. the insulating part is located on the coating film. the sealing resin seals the solder layer, the chip, the coating film, and the insulating part.