CO-PACKAGE OPTICS ASSEMBLY

Organization Name

international business machines corporation

Inventor(s)

CO-PACKAGE OPTICS ASSEMBLY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240264392 titled 'CO-PACKAGE OPTICS ASSEMBLY

Simplified Explanation: The patent application describes co-package optics structures that use an electromagnetic radiation absorption material layer to attach an optical link and/or waveguide structure to a coupling area on a photonic integrated chip. This material layer can provide either permanent or non-permanent attachment, allowing for testing and replacement of defective components.

The innovation involves using an electromagnetic radiation absorption material layer to attach optical components to a photonic integrated chip.
This attachment can be permanent or non-permanent, allowing for testing and replacement of defective components.
The technology enables efficient testing and replacement of optical links and waveguide structures in photonic integrated chips.
The electromagnetic radiation absorption material layer plays a crucial role in facilitating the attachment and detachment of optical components.
This innovation enhances the flexibility and reliability of optical systems in photonic integrated chips.

Potential Applications: This technology can be applied in the development of advanced optical communication systems, integrated photonics, data centers, and telecommunications infrastructure.

Problems Solved: 1. Facilitates testing and replacement of defective optical components in photonic integrated chips. 2. Enhances the reliability and flexibility of optical systems. 3. Improves the efficiency of optical communication systems.

Benefits: 1. Enables easy testing and replacement of optical components. 2. Enhances the reliability of optical systems. 3. Improves the overall performance of photonic integrated chips.

Commercial Applications: Optical communication equipment manufacturers, integrated photonics companies, data center operators, and telecommunications companies can benefit from this technology to enhance the performance and reliability of their systems.

Questions about Co-Package Optics Structures: 1. How does the electromagnetic radiation absorption material layer facilitate the attachment of optical components to the photonic integrated chip? 2. What are the potential applications of this technology beyond optical communication systems?

Frequently Updated Research: Researchers are continually exploring new materials and techniques to improve the efficiency and reliability of optical systems in photonic integrated chips. Stay updated on the latest advancements in this field for potential future applications and innovations.

Original Abstract Submitted

co-package optics structures are provided in which an electromagnetic radiation absorption material layer is used to attach an optical link and/or waveguide structure to a coupling area that is located on a photonic integrated chip. the electromagnetic radiation absorption material layer can provide permanent or a non-permanent attachment between the optical link and/or waveguide structure and the coupling area of the photonic integrated chip. in the non-permanent embodiment, testing can be performed to determine whether the optical link and/or waveguide structure is defective, and if determined to be defective, the defective optical link and/or waveguide structure can be replaced by a replacement optical link and/or waveguide structure by removing the electromagnetic radiation absorption material layer that attaches the defective structure.