Intel corporation (20250113460). FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES
FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES
Organization Name
Inventor(s)
Surya Pratap Mishra of Portland IN
Kari Mansukoski of Hillsboro OR US
Shantanu D. Kulkarni of Hillsboro OR US
FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES
This abstract first appeared for US patent application 20250113460 titled 'FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES
Original Abstract Submitted
systems, apparatus, articles of manufacture, and methods are disclosed for foldable thermal ground planes for electronic devices. an example an apparatus to cool an electronic device includes a first plate; a second plate; a plurality of first pillars extending between the first plate and the second plate, the plurality of first pillars having a first shape; a plurality of second pillars extending between the first plate and the second plate, the plurality of second pillars having a second shape, the second shape different than the first shape; and a hinge separating the apparatus into a first section and a second section, the plurality of second pillars in the hinge.