Intel corporation (20250112198). IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
Organization Name
Inventor(s)
Pratyasha Mohapatra of Hillsboro OR US
Kyle Davidson of Hillsboro OR US
Brian Franco of Portland OR US
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
This abstract first appeared for US patent application 20250112198 titled 'IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
Original Abstract Submitted
an apparatus is provided which comprises: a device surface, wherein the device surface comprises an array of solder contacts, a substrate surface, wherein the substrate surface comprises an array of pads, the array of solder contacts coupled with the array of pads, and a formation of epoxy coupled with the device surface and the substrate surface, wherein the formation of epoxy is entirely within an area of the array of solder contacts. other embodiments are also disclosed and claimed.