Intel corporation (20250076954). HIERARCHICAL POWER MANAGEMENT APPARATUS AND METHOD

HIERARCHICAL POWER MANAGEMENT APPARATUS AND METHOD

Organization Name

intel corporation

Inventor(s)

Vivek Garg of Folsom CA (US)

Ankush Varma of Portland OR (US)

Krishnakanth Sistla of Portland OR (US)

Nikhil Gupta of Portland OR (US)

Nikethan Shivanand Baligar of Hillsboro OR (US)

Stephen Wang of Hillsboro OR (US)

Nilanjan Palit of Northborough MA (US)

Timothy Yee-Kwong Kam of Portland OR (US)

Adwait Purandare of Hillsboro OR (US)

Ujjwal Gupta of Hillsboro OR (US)

Stanley Chen of Portland OR (US)

Dorit Shapira of Portland OR (US)

Shruthi Venugopal of Hillsboro OR (US)

Suresh Chemudupati of Austin TX (US)

Rupal Parikh of Hillsboro OR (US)

Eric Dehaemer of Shrewsbury MA (US)

Pavithra Sampath of Hudson MA (US)

Phani Kumar Kandula of Hillsboro OR (US)

Yogesh Bansal of Beaverton OR (US)

Dean Mulla of Saratoga CA (US)

Michael Tulanowski of Fort Collins CO (US)

Stephen Paul Haake of Sunnyvale CA (US)

Andrew Herdrich of Hillsboro OR (US)

Ripan Das of Beaverton OR (US)

Nazar Syed Haider of Fremont CA (US)

Aman Sewani of Sunnyvale CA (US)

HIERARCHICAL POWER MANAGEMENT APPARATUS AND METHOD

This abstract first appeared for US patent application 20250076954 titled 'HIERARCHICAL POWER MANAGEMENT APPARATUS AND METHOD

Original Abstract Submitted

hierarchical power management (hpm) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. at a simplest level, hpm architecture has a supervisor and one or more supervisee power management units (pmus) that communicate via at least two different communication fabrics. each pmu can behave as a supervisor for a number of supervisee pmus in a particular domain. hpm addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. hpm serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (soc). hpm provides a basis for managing power and thermals across a diverse set of dice.