Intel corporation (20250020874). STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT
STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT
Organization Name
Inventor(s)
Todd R. Coons of Gilbert AZ US
Michael Rutigliano of Chandler AZ US
Joe F. Walczyk of Tigard OR US
Abram M. Detofsky of Tigard OR US
STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT
This abstract first appeared for US patent application 20250020874 titled 'STACKABLE PHOTONICS DIE WITH DIRECT OPTICAL INTERCONNECT
Original Abstract Submitted
embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. the top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. the base die may be referred to as the photonics die. a system-on-a-chip (soc) may be electrically coupled with and stacked onto the top of the photonics die. other embodiments may be described and/or claimed.