Intel corporation (20250008685). FAN MODULES FOR ELECTRONIC DEVICES
FAN MODULES FOR ELECTRONIC DEVICES
Organization Name
Inventor(s)
Nirmala Bailur of Bangalore IN
Tongyan Zhai of Portland OR US
Chee Chun Yee of Bayan Lepas MY
Ruander Cardenas of Hillsboro OR US
Eng Huat Goh of Paya Terubong MY
Kavitha Nagarajan of Bangalore IN
Tin Poay Chuah of Bayan Baru MY
Martin M. Chang of Beaverton OR US
Shantanu D. Kulkarni of Hillsboro OR US
Telesphor Kamgaing of Chandler AZ US
FAN MODULES FOR ELECTRONIC DEVICES
This abstract first appeared for US patent application 20250008685 titled 'FAN MODULES FOR ELECTRONIC DEVICES
Original Abstract Submitted
systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. an example apparatus includes a fan module for an electronic device. the fan module includes a first cover; a second cover; an input/output (io) board adjacent the second cover, the second cover and io board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the io board.
- Intel corporation
- Jeff Ku of Taipei TW
- Nirmala Bailur of Bangalore IN
- Min Suet Lim of Gelugor MY
- Tongyan Zhai of Portland OR US
- Chee Chun Yee of Bayan Lepas MY
- Ruander Cardenas of Hillsboro OR US
- Lance Lin of Taipei TW
- Eng Huat Goh of Paya Terubong MY
- Javed Shaikh of Bengaluru IN
- Jun Liao of Portland OR US
- Kavitha Nagarajan of Bangalore IN
- Tin Poay Chuah of Bayan Baru MY
- Martin M. Chang of Beaverton OR US
- Shantanu D. Kulkarni of Hillsboro OR US
- Telesphor Kamgaing of Chandler AZ US
- H05K7/20
- F04D19/00
- F04D29/52
- G06F1/20
- CPC H05K7/202
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