Intel corporation (20250006691). COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
Organization Name
Inventor(s)
George Robinson of Chandler AZ US
Mohamed Elhebeary of Chandler AZ US
Mukund Ayalasomayajula of Chandler AZ US
Suraj Maganty of Chandler AZ US
Tingting Gao of Chandler AZ US
Andrew Wayne Carlson of Chandler AZ US
Khalid Mohammad Abdelaziz of Chandler AZ US
Craig Jerome Madison of Gilbert AZ US
Edvin Cetegen of Chandler AZ US
Joseph Petrini of Gilbert AZ US
COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
This abstract first appeared for US patent application 20250006691 titled 'COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
Original Abstract Submitted
compliant inserts for pin dipping processes are disclosed herein. an example apparatus disclosed herein includes a pin array to transfer material to a package substrate of an integrated circuit package, a cover plate, an elastic insert to be disposed between the cover plate and the pin array.
- Intel corporation
- George Robinson of Chandler AZ US
- Mohamed Elhebeary of Chandler AZ US
- Divya Jain of Mesa AZ US
- Viet Chau of Vancouver WA US
- Zewei Wang of Chandler AZ US
- Mukund Ayalasomayajula of Chandler AZ US
- Suraj Maganty of Chandler AZ US
- Tingting Gao of Chandler AZ US
- Andrew Wayne Carlson of Chandler AZ US
- Khalid Mohammad Abdelaziz of Chandler AZ US
- Craig Jerome Madison of Gilbert AZ US
- Edvin Cetegen of Chandler AZ US
- Joseph Petrini of Gilbert AZ US
- H01L23/00
- CPC H01L24/81
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