Intel corporation (20250006673). Cooling Methodology for Package-on-Package Structures
Cooling Methodology for Package-on-Package Structures
Organization Name
Inventor(s)
Siva Prasad Jangili Ganga of Jagityal Dist IN
Ajmeer Kaja Ayubkhan of Bangalore IN
Bharath Reddy Gudigopuram of Nalgonda IN
Cooling Methodology for Package-on-Package Structures
This abstract first appeared for US patent application 20250006673 titled 'Cooling Methodology for Package-on-Package Structures
Original Abstract Submitted
the present disclosure is directed to package-on-package structures having a package substrate with an embedded logic package disposed on the package substrate and having heat conductive pathways being provided in the package-on-package structure for removing heat from the logic package. in an aspect, the heat conductive pathways enable a downward transfer of the heat generated by the logic package toward the package substrate. in another aspect, the heat conducting pathways may include a heat transfer layer formed proximally to a bottom surface of the logic package. in a further aspect, the heat conducting pathways may include one or more metal vias in the package substrate.