Intel corporation (20240402445). HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
Organization Name
Inventor(s)
Bassam Ziadeh of Gilbert AZ (US)
Jingyi Huang of San Diego CA (US)
Vipul Mehta of Chandler AZ (US)
Joseph Van Nausdle of Chandler AZ (US)
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
This abstract first appeared for US patent application 20240402445 titled 'HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
Original Abstract Submitted
embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. these hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. in embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. other embodiments may be described and/or claimed.