Infineon technologies ag (20240251683). TWINNED MICROMACHINED ULTRASONIC TRANSDUCER simplified abstract
TWINNED MICROMACHINED ULTRASONIC TRANSDUCER
Organization Name
Inventor(s)
Mohanraj Soundara Pandian of Unterschleißheim (DE)
Marten Oldsen of Tanjung Bungah (MY)
TWINNED MICROMACHINED ULTRASONIC TRANSDUCER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240251683 titled 'TWINNED MICROMACHINED ULTRASONIC TRANSDUCER
Simplified Explanation: The patent application describes an ultrasonic transducer that includes both a capacitive transducer element and a piezoelectric transducer element, which are laterally separated on the same semiconductor die.
- The ultrasonic transducer consists of a set of transducer elements.
- The transducer elements include a capacitive transducer element and a piezoelectric transducer element.
- These elements are provided laterally separated on a single semiconductor die.
Key Features and Innovation:
- Combination of capacitive and piezoelectric transducer elements in a single device.
- Lateral separation of transducer elements on the same semiconductor die.
- Integration of different transducer technologies for improved performance.
Potential Applications: The technology can be used in medical imaging devices, industrial inspection equipment, and automotive sensors.
Problems Solved:
- Improved sensitivity and accuracy in ultrasonic measurements.
- Enhanced performance and reliability of ultrasonic transducers.
Benefits:
- Higher resolution imaging.
- Increased efficiency in industrial applications.
- Enhanced signal processing capabilities.
Commercial Applications: Potential commercial applications include medical ultrasound machines, non-destructive testing equipment, and automotive collision avoidance systems.
Questions about Ultrasonic Transducers: 1. How does the lateral separation of transducer elements improve performance? 2. What are the advantages of combining capacitive and piezoelectric transducer elements in a single device?
Original Abstract Submitted
examples disclose an ultrasonic transducer including a set of transducer elements including a capacitive transducer element and a piezoelectric transducer element, wherein the capacitive transducer element and the piezoelectric transducer element are provided laterally separated in a same semiconductor die. further examples disclose a method of manufacturing an ultrasonic transducer.