INTERNATIONAL BUSINESS MACHINES CORPORATION (20250118675). Modular Package of Quantum Hardware
Modular Package of Quantum Hardware
Organization Name
INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor(s)
Jae-Woong Nah of Closter NJ US
John Michael Cotte of New Fairfield CT US
Swetha Kamlapurkar of Yorktown Heights NY US
Nicholas A. Masluk of Putnam Valley NY US
Modular Package of Quantum Hardware
This abstract first appeared for US patent application 20250118675 titled 'Modular Package of Quantum Hardware
Original Abstract Submitted
a modular quantum computing structure includes a plurality of attachment structures, at least some of the attachment structures having different thicknesses. at least one of a plurality of qubit chips is bonded to a first attachment structure of the plurality of attachment structures having a first thickness. a second attachment structure of the plurality of attachment structures arranged adjacent the first attachment structure has a second thickness different from the first thickness of the first attachment structure. at least one of the qubit chips bonded to the first attachment structure has a footprint extending beyond a footprint of the first interposer to overlap at least the second interposer.