Huawei technologies co., ltd. (20250130616). COMPUTER SYSTEM AND SERVER
COMPUTER SYSTEM AND SERVER
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COMPUTER SYSTEM AND SERVER
This abstract first appeared for US patent application 20250130616 titled 'COMPUTER SYSTEM AND SERVER
Original Abstract Submitted
a computer system and a server are provided, to improve heat dissipation of the computer system and improve deployment space utilization of processors. the computer system includes a heat dissipation layer, a computing layer, and a high-speed layer. the computing layer includes a processor configured to generate an electrical signal. the heat dissipation layer includes a heat dissipation structure, the heat dissipation structure is coupled to the processor, and the heat dissipation structure is configured to dissipate heat for the processor. the high-speed layer includes a cable module configured to transmit the electrical signal, and the cable module is coupled to the processor.