Huawei technologies co., ltd. (20240427082). OPTICAL CHIP AND PREPARATION METHOD THEREFOR

OPTICAL CHIP AND PREPARATION METHOD THEREFOR

Organization Name

huawei technologies co., ltd.

Inventor(s)

Xinxiang Niu of Hangzhou (CN)

Xiang Zhang of Shenzhen (CN)

Xiaowen Dong of Shenzhen (CN)

OPTICAL CHIP AND PREPARATION METHOD THEREFOR

This abstract first appeared for US patent application 20240427082 titled 'OPTICAL CHIP AND PREPARATION METHOD THEREFOR

Original Abstract Submitted

this application provides an optical chip. the optical chip includes an optical substrate, and a first functional layer, a first space layer, and a second functional layer that are sequentially disposed on the optical substrate. a second optical structure is formed at the second functional layer. the second optical structure includes a second inter-layer coupling structure and a second intra-layer transmission structure, and the second intra-layer transmission structure is located in a first area of the second functional layer. a first optical structure located in a second area is formed at the first functional layer. the first optical structure includes a first inter-layer coupling structure and a first intra-layer transmission structure, and a projection of the second area in a normal direction of a plane of the optical substrate does not overlap with a projection of the first area in the normal direction of the plane of the optical substrate.