LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS

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LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240324143 titled 'LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS

The abstract describes a liquid cooling structure that includes a liquid storage portion, a condenser, a liquid return channel, and a liquid cooling portion designed to store and spray a liquid state cooling medium onto a to-be-cooled member.

The liquid cooling portion features a spraying member and a sealing member with a first sealed cavity to accommodate the to-be-cooled member.
The condenser cools the gaseous state cooling medium to form the liquid state cooling medium.
The liquid return channel transfers the liquid state cooling medium from the first sealed cavity back to the liquid storage portion.

Potential Applications: - This technology can be applied in electronic devices to efficiently cool components. - It can be used in industrial machinery to prevent overheating and improve performance.

Problems Solved: - Addresses the issue of overheating in electronic devices and machinery. - Provides a more efficient cooling solution compared to traditional methods.

Benefits: - Improved cooling efficiency. - Extended lifespan of electronic components. - Enhanced performance of machinery.

Commercial Applications: Liquid cooling structures can be utilized in various industries such as electronics, automotive, and manufacturing to enhance cooling capabilities and optimize performance.

Questions about Liquid Cooling Structures: 1. How does this technology compare to traditional air cooling methods?

  - Liquid cooling structures offer more efficient cooling compared to air cooling methods by utilizing a liquid state cooling medium.

2. What are the potential cost implications of implementing this technology in different industries?

  - The initial investment in liquid cooling structures may vary depending on the scale of implementation and industry requirements.

Original Abstract Submitted

a liquid cooling structure is provided. the structure includes a liquid storage portion, a condenser, a liquid return channel and a liquid cooling portion having a liquid storage cavity configured to store a liquid state cooling medium. the liquid cooling portion includes a spraying member and a sealing member having a first sealed cavity configured to accommodate a to-be-cooled member, the spraying member communicates with the liquid storage cavity, and is configured to spray the cooling medium onto the to-be-cooled member. the condenser communicates with the first sealed cavity and the liquid storage cavity, and is configured to cool the gaseous state cooling medium to form the cooling medium in the liquid state. the liquid return channel communicates with the first sealed cavity and the liquid storage cavity, and is configured to transfer the liquid state cooling medium in the first sealed cavity to the liquid storage cavity.