Huawei technologies co., ltd. (20240237295). HEAT DISSIPATION APPARATUS AND SERVER simplified abstract

HEAT DISSIPATION APPARATUS AND SERVER

Organization Name

huawei technologies co., ltd.

Inventor(s)

Weiming Liu of Shenzhen (CN)

Shanjiu Chi of Dongguan (CN)

Xiaoxiao Lu of Hangzhou (CN)

HEAT DISSIPATION APPARATUS AND SERVER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240237295 titled 'HEAT DISSIPATION APPARATUS AND SERVER

Simplified Explanation: The patent application describes a heat dissipation apparatus for a server, consisting of both air-cooling and liquid-cooling structures. The air-cooling structure cools two different components simultaneously, while the liquid-cooling structure specifically cools the component generating more heat.

Key Features and Innovation:

• Simultaneous air cooling of two different components in a server.
• Liquid cooling of the component generating higher heat.
• Liquid-cooling assembly for conducting heat into a coolant.
• Heat exchanger for exchanging heat between the coolant and external air.

Potential Applications: This technology can be applied in various server systems and data centers where efficient heat dissipation is crucial for optimal performance and longevity of components.

Problems Solved: This technology addresses the challenge of uneven heat distribution within servers, ensuring that components generating more heat are adequately cooled to prevent overheating and potential damage.

Benefits:

• Enhanced cooling efficiency.
• Improved performance and reliability of server components.
• Extended lifespan of server systems.
• Reduced risk of overheating-related failures.

Commercial Applications: The technology can be utilized in server farms, cloud computing facilities, and other data centers to enhance the overall performance and reliability of server systems, potentially reducing maintenance costs and downtime.

Questions about Heat Dissipation Technology: 1. How does the liquid-cooling structure in this technology differ from traditional air-cooling methods? 2. What are the specific benefits of simultaneously air cooling two different components in a server system?

Original Abstract Submitted

a heat dissipation apparatus including an air-cooling structure and a liquid-cooling structure, and a server are provided. the air-cooling structure is configured to simultaneously perform air cooling on a first-type component and a second-type component, and the liquid-cooling structure is configured to perform liquid cooling on the first-type component, where heat generated by the first-type component is higher than heat generated by the second-type component. the liquid-cooling structure specifically includes a liquid-cooling assembly and a heat exchanger. the liquid-cooling assembly can conduct the heat generated by the first-type component into a coolant in a liquid-cooling pipe of the liquid-cooling assembly. the heat exchanger is configured for heat exchange between the coolant and external air, and the heat exchanger herein is disposed at a tail end of the server.