Honda motor co., ltd. (20250083250). BONDING DEVICE
BONDING DEVICE
Organization Name
Inventor(s)
Akiyoshi Miyawaki of Saitama (JP)
BONDING DEVICE
This abstract first appeared for US patent application 20250083250 titled 'BONDING DEVICE
Original Abstract Submitted
a bonding device is used to bond a plate assembly including a first plate and a second plate and includes an anvil, a probe, a shoulder component, a driving mechanism, a power supply, and a control part. the anvil is configured to support a first surface of the plate assembly provided by the first plate. the probe is disposed at a position corresponding to the anvil to be opposite to a second surface of the plate assembly provided by the second plate. the shoulder component is disposed around the probe and has a via for the probe to pass through and an abutting surface for pressing the second surface. the anvil has a hemispherical surface facing the first surface and a receiving surface disposed at a position corresponding to the abutting surface. the anvil contacts the first surface with the hemispherical surface and the receiving surface.