Hewlett-Packard Development Company, L.P. patent applications on July 25th, 2024
Patent Applications by Hewlett-Packard Development Company, L.P. on July 25th, 2024
Hewlett-Packard Development Company, L.P.: 14 patent applications
Hewlett-Packard Development Company, L.P. has applied for patents in the areas of B33Y10/00 (5), B33Y30/00 (4), B29C64/165 (3), B29C64/264 (2), B33Y40/20 (2) B22F10/14 (2), B29C64/165 (2), A45C11/34 (1), B01L7/52 (1), C09D177/00 (1)
With keywords such as: device, agent, material, include, build, layers, some, power, examples, and including in patent application abstracts.
Patent Applications by Hewlett-Packard Development Company, L.P.
Inventor(s): Xiang Ma of Spring TX (US) for hewlett-packard development company, l.p., Wei Hung Lin of Taipei City (TW) for hewlett-packard development company, l.p., Simon Wong of Spring TX (US) for hewlett-packard development company, l.p.
IPC Code(s): A45C11/34
CPC Code(s): A45C11/34
Abstract: an example of the present disclosure includes a packaging box, comprising a first section including a first aperture to receive a portion of a writing device, and a second section including a second aperture to receive a remainder of the writing device. the packaging box further includes a hinge mechanism coupling the first section to the second section, wherein the first section and second section are rotatable about the hinge mechanism. the packaging box also includes a tip remover including a surface to remove a tip of the writing device responsive to application of a force.
Inventor(s): Carson Denison of Corvallis OR (US) for hewlett-packard development company, l.p., Alexander Govyadinov of Corvallis OR (US) for hewlett-packard development company, l.p., Richard W. Seaver of Corvallis OR (US) for hewlett-packard development company, l.p., Erik D. Torniainen of Corvallis OR (US) for hewlett-packard development company, l.p., Pavel Kornilovich of Corvallis OR (US) for hewlett-packard development company, l.p., Anand Samuel Jebakumar of Corvallis OR (US) for hewlett-packard development company, l.p.
IPC Code(s): B01L7/00
CPC Code(s): B01L7/52
Abstract: apparatuses may be used for nucleic acid amplification. an example apparatus may include an amplification chamber to contain a biochemical reaction associated with amplification of a biologic sample. the biologic sample may include a nucleic acid. the apparatus may also include a heater thermally coupled to the amplification chamber. the apparatus may also include a thermally conductive substrate in contact with the heater and including a liquid coolant passage to pass a liquid coolant through the thermally conductive substrate.
Inventor(s): Ian Pahk of Corvallis OR (US) for hewlett-packard development company, l.p., Vladek Kasperchik of Corvallis OR (US) for hewlett-packard development company, l.p., Thomas M. Sabo of San Diego CA (US) for hewlett-packard development company, l.p., Cory J. Ruud of Corvallis OR (US) for hewlett-packard development company, l.p., Tienteh Chen of San Diego CA (US) for hewlett-packard development company, l.p.
IPC Code(s): B22F10/14, B22F3/24, B33Y10/00, B33Y30/00, B33Y70/10
CPC Code(s): B22F10/14
Abstract: a three-dimensional printing kit, as presented herein, can include a particulate build material and a binder agent. the particulate build material can include from about 80 wt % to 100 wt % metal particles based on the total weight of the particulate build material. the binder agent can include an aqueous liquid vehicle, an acrylic polymer or copolymer latex dispersion, a sulfonated small-molecule dispersed pigment, and a solubilized dihydrazide. a sulfonated small-molecule of the sulfonated small-molecule dispersed pigment can be from about 100 g/mol to about 2000 g/mol. the binder agent can exclude a polymeric dispersant.
Inventor(s): Jason C. Hower of Corvallis OR (US) for hewlett-packard development company, l.p., Mohammed S. Shaarawi of Corvallis OR (US) for hewlett-packard development company, l.p., Vladek P. Kasperchik of Corvallis OR (US) for hewlett-packard development company, l.p., James McKinnell of Corvallis OR (US) for hewlett-packard development company, l.p., Jennifer L. Wu of Corvallis OR (US) for hewlett-packard development company, l.p.
IPC Code(s): B22F10/14, B22F1/107, B22F10/47, B33Y10/00
CPC Code(s): B22F10/14
Abstract: in an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3d object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. the binding agent and/or a void-formation agent is selectively applied, based on the 3d object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. this patterns an area that is to contain voids. the intermediate structure is heated to form a 3d structure including a void-containing breakable connection.
Inventor(s): Emre Hiro Discekici of San Diego CA (US) for hewlett-packard development company, l.p., Geoffrey Schmid of San Diego CA (US) for hewlett-packard development company, l.p., Alay Yemane of San Diego CA (US) for hewlett-packard development company, l.p.
IPC Code(s): B29C64/165, B29C64/188, B29C64/264, B29C71/02, B29K21/00, B33Y10/00, B33Y30/00, B33Y40/20
CPC Code(s): B29C64/165
Abstract: a three-dimensional printing system can include a build material including from about 95 wt % to 100 wt % of thermoplastic elastomer particles having a d50 particle size from about 2 �m to about 150 �m, and a printhead fluidly coupled to or fluidly coupleable to a fusing agent to selectively and iteratively eject the fusing agent onto successive placed individual layers thereof. the fusing agent can include water and a radiation absorber. the three-dimensional printing system can also include a radiant energy source positioned to expose the individual layers of the build material to radiation energy to selectively fuse the thermoplastic elastomer particles in contact with the radiation absorber to iteratively form a three-dimensional object including multiple layers of fused thermoplastic elastomer, and a heating device to heat the three-dimensional object to a temperature sufficient that layer-to-layer fusion at an interior location of the three-dimensional object is enhanced.
Inventor(s): Emre Hiro Discekici of San Diego CA (US) for hewlett-packard development company, l.p., Shannon Reuben Woodruff of San Diego CA (US) for hewlett-packard development company, l.p., Alay Yemane of San Diego CA (US) for hewlett-packard development company, l.p.
IPC Code(s): B29C64/165, B29C64/35, B33Y10/00, B33Y30/00, B33Y40/20, B33Y70/00
CPC Code(s): B29C64/165
Abstract: the present disclosure describes three-dimensional printing kits, methods of making three-dimensional printed objects, and three-dimensional printing systems. in one example, a three-dimensional printing kit can include a power bed material including thermoplastic polymer particles, a fusing agent to selectively apply to the powder bed material, and a post-processing agent to apply to a three-dimensional printed object. the fusing agent can include water and a radiation absorber that absorbs radiation and converts the radiation energy to heat. the post-processing agent can include a curable epoxy resin, where the epoxy resin, when cured, has a higher elastic modulus than the thermoplastic polymer particles.
Inventor(s): James William Stasiak of Corvallis OR (US) for hewlett-packard development company, l.p., Emre Hiro Discekici of San Diego CA (US) for hewlett-packard development company, l.p., Dennis J. Schissler of San Diego CA (US) for hewlett-packard development company, l.p.
IPC Code(s): C09D177/00, B29C64/165, B29C64/264, B29C64/30, B29K77/00, B29K105/04, B33Y10/00, B33Y30/00, B33Y70/00, C08J9/08, C08J9/10, C08K3/04, C09D7/61, C09D7/63
CPC Code(s): C09D177/00
Abstract: the present disclosure provides methods of three-dimensional printing, including iteratively applying individual build material layers of polyamide particles and selectively applying a fusing agent onto the individual build material layers to form individually patterned object layers. the fusing agent can include water and a radiation absorber. the method can also include selectively applying a pore-promoting agent onto the individual build material layers at some or all of the individually pattered object layers to form a pore-generating region, and iteratively exposing the individual build material layers to electromagnetic energy to generate molten polymer from polyamide particles in contact with the radiation absorber that upon cooling forms fused polymer body. a material used to form the fused polymer body without pores can exhibit a material dielectric permittivity, and the fused polymer body at a location that includes the pores can exhibit a decreased dielectric permittivity.
Inventor(s): Yun David Tang of Spring TX (US) for hewlett-packard development company, l.p., Nick Thamma of Spring TX (US) for hewlett-packard development company, l.p., Hui Leng Lim of Spring TX (US) for hewlett-packard development company, l.p., Yi Ying Lai of Taipei City (TW) for hewlett-packard development company, l.p., Davis Matthew Castillo of Spring TX (US) for hewlett-packard development company, l.p., Pei Hsuan Li of Taipei City (TW) for hewlett-packard development company, l.p.
IPC Code(s): G06F1/20, G06F1/3231, G06F1/3287
CPC Code(s): G06F1/206
Abstract: an example device comprises: a surface-type sensor to detect a type of surface on which the device is located; a proximity sensor; and a processor. the processor is to: in response to detecting, using the surface-type sensor, that the device is located on a soft-type surface, increase noise output of the device; and, in response to detecting, using the proximity sensor, that a plurality of persons are proximal the device, decrease the noise output of the device.
Inventor(s): Chee Keat Fong of Spring TX (US) for hewlett-packard development company, l.p., Alexander Joseph Pienkawa Rosenbach of Spring TX (US) for hewlett-packard development company, l.p., Valiuddin Ali of Spring TX (US) for hewlett-packard development company, l.p., Jeffrey Kevin Jeansonne of Spring TX (US) for hewlett-packard development company, l.p., Richard Alden Bramley, Jr. of Mansfield MA (US) for hewlett-packard development company, l.p.
IPC Code(s): G06F9/4401
CPC Code(s): G06F9/4416
Abstract: according to aspects of the present disclosure, there is provided a non-transitory computer-readable storage medium comprising instructions that when executed cause a processor of a computing device to: send, to a remote device and via a first message queue on a cloud messaging service, a current basic input/output system (bios) setting value; receive, from the remote device and via a second message queue on a cloud messaging service, an updated bios setting value and a cryptographic value; decrypt an encrypted private key of a public-private key pair stored in a memory of the computing device using the cryptographic value, wherein the public key of the public-private key pair is associated with a bios of the computing device; sign the updated bios setting value using the decrypted private key; provide the signed bios setting value to the bios of the computing device.
Inventor(s): Peter Andrew Seiler of Fort Collins CO (US) for hewlett-packard development company, l.p., Byron A. Alcorn of Fort Collins CO (US) for hewlett-packard development company, l.p., Clifton Robin of Fort Collins CO (US) for hewlett-packard development company, l.p., John Michael Stahl of Fort Collins CO (US) for hewlett-packard development company, l.p., Patrick S. Anderson of Fort Collins CO (US) for hewlett-packard development company, l.p., Eric John Gressman of Fort Collins CO (US) for hewlett-packard development company, l.p., Douglas Allen Reynolds of Fort Collins CO (US) for hewlett-packard development company, l.p., Joseph-Jonathan Salzano of Fort Collins CO (US) for hewlett-packard development company, l.p., Gregory Mark Hughes of Fort Collins CO (US) for hewlett-packard development company, l.p.
IPC Code(s): G06F13/10
CPC Code(s): G06F13/10
Abstract: in some examples, an electronic device includes a network interface to connect to a computer network, a display port operating as a display input, an input/output port, memory having a plurality of profiles, and a processor coupled to the memory. in some examples, the processor is to change an operation of the input/output port based on a profile of the plurality of profiles. in some examples, the processor is to change the display port from the display input to a display output based on the profile of the plurality of profiles.
Inventor(s): Gregory Gore Staten of Spring TX (US) for hewlett-packard development company, l.p., Alexander Morgan Williams of Spring TX (US) for hewlett-packard development company, l.p.
IPC Code(s): G09G5/00
CPC Code(s): G09G5/006
Abstract: in some examples, a method includes detecting a trigger to modify static refresh rate metadata stored on a display device. in some examples, the method includes modifying, at the display device, the static refresh rate metadata to produce modified refresh rate metadata. in some examples, the method includes sending the modified refresh rate metadata to a source device.
Inventor(s): Anthony Nicholas Kaplanis of Spring TX (US) for hewlett-packard development company, l.p., Alexander Morgan Williams of Spring TX (US) for hewlett-packard development company, l.p., Gregory Gore Staten of Spring TX (US) for hewlett-packard development company, l.p.
IPC Code(s): G09G5/14, G06F3/01, G06F3/14, G06V20/40
CPC Code(s): G09G5/14
Abstract: in some examples, a method includes determining a context indicating a displayed media type based on a received first video signal. in some examples, the method includes classifying a received second video signal to produce a classification of the received second video signal indicating a media type of the received second video signal. in some examples, the method includes determining size and location settings based on the context and the classification. in some examples, the method includes using the size and location settings to cause the second video signal to be presented on a display.
Inventor(s): Gideon AMIR of Ness Ziona (IL) for hewlett-packard development company, l.p., Tadej TURK of Vienna (AT) for hewlett-packard development company, l.p.
IPC Code(s): H04N1/32, H04N1/405
CPC Code(s): H04N1/32256
Abstract: in an example, a method includes, at least one processor, in response to each of a plurality of requests, determining a halftone screen. determining the halftone screen comprises encoding a signature pattern in the halftone screen, and halftone screens for different requests may be encoded with a different signature pattern. the halftone screen may be arranged such that, when applied to image data to provide a printed output, the pattern is discernible therein to provide a signature for the printed output.
Inventor(s): Tyler SIMS of Corvallis OR (US) for hewlett-packard development company, l.p., William ALLEN of Corvallis OR (US) for hewlett-packard development company, l.p., Qiwei WANG of Palo Alto CA (US) for hewlett-packard development company, l.p.
IPC Code(s): H04W52/40, H04B7/04, H04W84/18
CPC Code(s): H04W52/40
Abstract: in one example, a method of relaying energy to device nodes is disclosed. the method includes transmitting energy waves into an aggregated node group with multiple device nodes. the transmitted energy waves are to actuate the device nodes into a higher power state and in part for storage by the device nodes. energy streams reflected by the aggregated node group may be captured to indicate actuated and non-actuated device nodes. the method determines a target low power state device node from the non-actuated low power state device nodes and determine neighboring higher power state device nodes proximate to the target low power state device node. a communication signal may be transmitted to the neighboring higher power state device nodes directing them to relay the stored energy to the target low power state device node to actuate the target low power state device node into a higher power state.
Hewlett-Packard Development Company, L.P. patent applications on July 25th, 2024
- Hewlett-Packard Development Company, L.P.
- A45C11/34
- CPC A45C11/34
- Hewlett-packard development company, l.p.
- B01L7/00
- CPC B01L7/52
- B22F10/14
- B22F3/24
- B33Y10/00
- B33Y30/00
- B33Y70/10
- CPC B22F10/14
- B22F1/107
- B22F10/47
- B29C64/165
- B29C64/188
- B29C64/264
- B29C71/02
- B29K21/00
- B33Y40/20
- CPC B29C64/165
- B29C64/35
- B33Y70/00
- C09D177/00
- B29C64/30
- B29K77/00
- B29K105/04
- C08J9/08
- C08J9/10
- C08K3/04
- C09D7/61
- C09D7/63
- CPC C09D177/00
- G06F1/20
- G06F1/3231
- G06F1/3287
- CPC G06F1/206
- G06F9/4401
- CPC G06F9/4416
- G06F13/10
- CPC G06F13/10
- G09G5/00
- CPC G09G5/006
- G09G5/14
- G06F3/01
- G06F3/14
- G06V20/40
- CPC G09G5/14
- H04N1/32
- H04N1/405
- CPC H04N1/32256
- H04W52/40
- H04B7/04
- H04W84/18
- CPC H04W52/40
