HONDA MOTOR CO., LTD. patent applications on January 2nd, 2025
Patent Applications by HONDA MOTOR CO., LTD. on January 2nd, 2025
HONDA MOTOR CO., LTD.: 20 patent applications
HONDA MOTOR CO., LTD. has applied for patents in the areas of C08J11/14 (3), B60R21/207 (2), H02K1/22 (2), H02K1/12 (2), H05K1/02 (2) C08J11/14 (3), B60R21/207 (2), H01M4/382 (1), H05K1/0277 (1), H02K3/26 (1)
With keywords such as: information, vehicle, portion, configured, unit, device, control, power, frame, and resin in patent application abstracts.
Patent Applications by HONDA MOTOR CO., LTD.
Inventor(s): Tzu-pu TSENG of Marysville OH (US) for honda motor co., ltd., Nicholas H. GOLDSBERRY of Powell OH (US) for honda motor co., ltd., Brian A. PENZA of Powell OH (US) for honda motor co., ltd., Liza G. BARE of Powell OH (US) for honda motor co., ltd., Austin B. KIMBRELL of Powell OH (US) for honda motor co., ltd.
IPC Code(s): B60R13/00
CPC Code(s): B60R13/005
Abstract: a recessed portion of a vehicle surface may include an upper edge portion surrounding a portion of the recessed portion, an inner wall of the recessed portion, a plurality of dentil protrusions extending from the inner wall, and a fascia component disposed in a portion of the recessed portion, wherein a gap is disposed between the fascia component and the upper edge portion, wherein at least some of the plurality of dentil protrusions are a disposed in an air channel defined by the gap.
20250001964. INSTALLATION STRUCTURE_simplified_abstract_(honda motor co., ltd.)
Inventor(s): Keita ISHIZAKA of Tokyo (JP) for honda motor co., ltd., Makoto NODA of Tokyo (JP) for honda motor co., ltd., Tomohiro TAKAHASHI of Tokyo (JP) for honda motor co., ltd., Daiki NAKATSU of Tokyo (JP) for honda motor co., ltd.
IPC Code(s): B60R21/20
CPC Code(s): B60R21/20
Abstract: an installation structure includes: an air bag, disposed on an indoor side of a vehicle body; an interior, covering the air bag; and a fastener, connected with the interior and installed to the vehicle body. the fastener includes a vehicle body side component installed to the vehicle body and an interior side component installed to the interior. one of the vehicle body side component and the interior side component includes a male part. the other includes a female part engaged with the male part and including: a first wall, extending in an insertion direction where the fastener is inserted into the vehicle body; a second wall, parallel to the first wall; and an engagement part, provided on the first wall and engaged with the male part. when the male and female parts are engaged, a space is formed adjacent to the male part and between the first and second walls.
20250001977. WIPER DEVICE_simplified_abstract_(honda motor co., ltd.)
Inventor(s): Jumpei YAMASHITA of Tokyo (JP) for honda motor co., ltd., Takeshi SASAKI of Tokyo (JP) for honda motor co., ltd.
IPC Code(s): B60S1/34, B60S1/38, B60S1/52
CPC Code(s): B60S1/3479
Abstract: the disclosure provides a wiper device including: an adapter member; a blade structure, including an element portion and a blade portion, where the element portion has an insertion portion and a holding portion, the insertion portion is inserted into an interior of the adapter member, and the holding portion holds the blade portion below the adapter member; a first cover, covering a gap between the holding portion and the adapter member and attached to the adapter member along a first direction perpendicular to an extending direction of the blade structure; and a second cover, covering the gap and attached to the adapter member along a second direction perpendicular to the extending direction.
20250002017. VEHICLE CONTROL DEVICE AND CONTROL METHOD_simplified_abstract_(honda motor co., ltd.)
Inventor(s): Kazuki TOMIOKA of Tokyo (JP) for honda motor co., ltd., Yoshimitsu MURAHASHI of Tokyo (JP) for honda motor co., ltd.
IPC Code(s): B60W30/16, B60W50/10, G06V20/59
CPC Code(s): B60W30/162
Abstract: a vehicle control device is configured to execute travel control of controlling a vehicle such that the vehicle travels at a target speed corresponding to an inter-vehicle distance between a preceding vehicle that travels in front of the vehicle and the vehicle, or a predetermined speed set by a driver of the vehicle. the vehicle control device is configured to temporarily stop the travel control in response to the driver applying a brake of the vehicle, and to restart the travel control in response to the driver releasing the brake in the vehicle during travel by the travel control, and the vehicle control device includes a control circuit that does not restart the travel control, when the brake is released in a case where a predetermined condition is satisfied.
Inventor(s): Yutaka Aikyo of Wako-shi, Saitama (JP) for honda motor co., ltd.
IPC Code(s): B62J27/20, A41D13/05, B62J1/00
CPC Code(s): B62J27/20
Abstract: in a saddled vehicle, a vehicle, and a rider protector, an airbag is made compact, and the airbag is prevented from being obstructed by arms of a rider, so that the airbag properly protects the rider. a saddled vehicle includes a seat for a rider and an airbag provided in front of the seat. the airbag includes a first deploying portion that is deployed upward when deployed, a second deploying portion that branches and extends from the first deploying portion when deployed; and the second deploying portion extends outward in a vehicle width direction from the first deploying portion.
Inventor(s): Shuta Suzuki of Wako-shi (JP) for honda motor co., ltd., Tsuyoshi Baba of Wako-shi (JP) for honda motor co., ltd., Satoshi Hirawaki of Wako-shi (JP) for honda motor co., ltd.
IPC Code(s): C08J11/08, B01D19/00, B01D21/26, B01F23/53, B01F23/80, B01F35/21, B01F35/212, B01F35/221, B01F35/222, B01F35/71, B01F35/92, B01F101/00, B29B17/02, B29K77/00, B29K105/16, B29K509/08
CPC Code(s): C08J11/08
Abstract: a dissolution apparatus configured to dissolve a waste resin in a dissolution tank with a solvent. the dissolution apparatus includes: a supply device configured to supply the waste resin and the solvent into the dissolution tank; a heating device configured to heat the waste resin and the solvent supplied to the dissolution tank; a stirrer configured to stir the waste resin and the solvent, heated by the heating device; a torque sensor configured to detect a load torque acting on the stirrer; and a microprocessor. the microprocessor is configured to perform: calculating a viscosity of a solution of the waste resin and the solvent based on the load torque detected by the torque sensor, and controlling at least one of the supply device and the heating device such that the viscosity calculated in the calculating becomes less than a predetermined value.
20250002670. DEPOLYMERIZATION SYSTEM_simplified_abstract_(honda motor co., ltd.)
Inventor(s): Tsuyoshi Baba of Wako-shi (JP) for honda motor co., ltd., Shuta Suzuki of Wako-shi (JP) for honda motor co., ltd.
IPC Code(s): C08J11/14
CPC Code(s): C08J11/14
Abstract: a depolymerization system including: a dissolver configured to dissolve a resin using a solvent; a solid-liquid separator configured to separate a solution containing the resin and the solvent dissolved by the dissolver into a solid and a liquid; an evaporator configured to evaporate the solvent contained in the liquid separated from the solution; a depolymerizer configured to perform a depolymerization reaction between the liquid from which the solvent is evaporated by the evaporator and water; a concentrator configured to heat and concentrate a reaction product of the depolymerizer, a condenser configured to condense a vapor of the solvent generated in the evaporator; and a heat transferrer configured to transfer a condensing heat generated when the vapor of the solvent is condensed by the condenser to the dissolver and the concentrator.
Inventor(s): Tsuyoshi Baba of Wako-shi (JP) for honda motor co., ltd., Shuta Suzuki of Wako-shi (JP) for honda motor co., ltd.
IPC Code(s): C08J11/14
CPC Code(s): C08J11/14
Abstract: a depolymerization system includes: a depolymerization apparatus configured to perform a depolymerization reaction between a molten resin supplied from the resin tank and a water supplied from the water tank; a pump configured to supply the molten resin from the resin tank to the depolymerization apparatus; and a pump control device. the pump control device comprises a microprocessor configured to perform: acquiring information of a viscosity of the molten resin, a density of the molten resin, and a pressure difference between the resin tank and the depolymerization apparatus; calculating a control command value corresponding to a target flow rate of the molten resin; calculating a volume efficiency of the pump based on the information of the viscosity, the density, and the pressure difference; correcting the control command value based on the volume efficiency; and outputting the corrected control command value to the pump.
20250002672. DEPOLYMERIZATION LIQUID GENERATION DEVICE_simplified_abstract_(honda motor co., ltd.)
Inventor(s): Tsuyoshi Baba of Wako-shi (JP) for honda motor co., ltd., Shuta Suzuki of Wako-shi (JP) for honda motor co., ltd.
IPC Code(s): C08J11/14
CPC Code(s): C08J11/14
Abstract: depolymerization liquid generation device includes: depolymerization liquid generation unit configured to knead plastic and water under heating environment to generate depolymerization liquid; back pressure valve configured to adjust pressure of depolymerization liquid from depolymerization liquid generation unit; first heat exchange unit provided in flow path between depolymerization liquid generation unit and back pressure valve; second heat exchange unit provided in supply path of water supplied to depolymerization liquid generation unit; temperature controller configured to adjust temperature of heat medium circulating through first heat exchange unit and second heat exchange unit; and switching valve configured to switch between first flow path for circulating heat medium from temperature controller to temperature controller through first heat exchange unit and second flow path for circulating heat medium from temperature controller to temperature controller through first heat exchange unit and second heat exchange unit.
Inventor(s): Takayuki Ishibashi of Tokyo (JP) for honda motor co., ltd., Takahiro Yoshii of Tokyo (JP) for honda motor co., ltd., Yudai Okabe of Tokyo (JP) for honda motor co., ltd., Shogo Shibahara of Tokyo (JP) for honda motor co., ltd., Hirofumi Yabu of Tokyo (JP) for honda motor co., ltd., Kohei Mukaihara of Tokyo (JP) for honda motor co., ltd., Kohei Saito of Tokyo (JP) for honda motor co., ltd.
IPC Code(s): G07C5/08
CPC Code(s): G07C5/0816
Abstract: a repair information provision apparatus, includes: a processor and a memory coupled to the processor. the apparatus is configured to perform: acquiring first information including a diagnostic trouble code transmitted from a vehicle provided with an on-board diagnostics function; acquiring second information including a repair timing and a repair content of a repair performed on the vehicle and inputted by a worker; associating the diagnostic trouble code included in the first information with the repair content included in the second information based on a transmission timing of the first information and the repair timing included in the second information; storing a correspondence between the diagnostic trouble code and the repair content associated; and outputting repair information on the repair content corresponding to the diagnostic trouble code included in the first information based on the correspondence when the first information is acquired after the correspondence is stored.
Inventor(s): Yoshiaki SUGIMOTO of Tokyo (JP) for honda motor co., ltd.
IPC Code(s): G08G1/01, G06F21/62
CPC Code(s): G08G1/0129
Abstract: an information providing device includes a communication unit that receives location information of a plurality of vehicles ; a storage unit that stores map information including road maps; a departure/arrival point location information generating unit (for example, “departure/arrival point location information generating unit ” described hereinafter) that accumulates the location information for discretely changing time for respective moving bodies, calculates a mode of the location information for the respective moving bodies, and generates, as departure/arrival point location information, plane information including the location information of the mode; and a location information outputting unit (for example, “location information outputting unit ” described hereinafter) that, for each moving body of the plurality of moving bodies, outputs the plane information and also outputs the location information beyond a location separated by a prescribed distance from the position of the mode.
Inventor(s): Kazuki SAIMEN of Saitama (JP) for honda motor co., ltd.
IPC Code(s): H01M4/38, H01M4/02, H01M4/04, H01M4/66, H01M10/0525
CPC Code(s): H01M4/382
Abstract: a negative electrode for a lithium metal secondary battery according to an embodiment of the present invention includes a negative electrode current collector, and a lithium-containing metal layer disposed on at least one surface of the negative electrode current collector, at least a part of a surface of the lithium-containing metal layer has an uneven shape, the surface has a developed area ratio sdr of 1.0 or more, and the surface is coated with an antioxidant film.
Inventor(s): Yuki Kurisu of Wako-shi, Saitama-ken (JP) for honda motor co., ltd., Tomoya Yamagishi of Wako-shi, Saitama-ken (JP) for honda motor co., ltd., Makoto Ogawa of Wako-shi, Saitama-ken (JP) for honda motor co., ltd.
IPC Code(s): H02J3/06, H02J3/14, H02J3/32, H02J3/46, H02M7/48
CPC Code(s): H02J3/06
Abstract: a power source device and a control method therefor execute control in which, when an interrupter switches from a blocked state to a connected state, a first state amount, which correlates to the frequency of a/c voltage out-put to the interrupter, from each of a first converter and a second converter match each other, and a second state amount correlating to the phase of the a/c voltage therefrom match each other.
Inventor(s): Takayuki ENOMOTO of Wako-shi (JP) for honda motor co., ltd., Yasuhiro NAKADA of Wako-shi (JP) for honda motor co., ltd., Kenji SHIBATA of Wako-shi (JP) for honda motor co., ltd., Miho TOKUNAGA of Wako-shi (JP) for honda motor co., ltd., Ryuichi KIMATA of Tokyo (JP) for honda motor co., ltd.
IPC Code(s): H02J3/14, H02J13/00
CPC Code(s): H02J3/144
Abstract: a management device controls an interruption unit provided between a power supply source and each of a plurality of outlets. the device determines whether it is in a supply shortage state, determines priorities of the plurality of outlets, and switches the interruption unit associated with an outlet having a low priority to a disconnection state in a case of a supply shortage state. each of the plurality of outlets includes an acquisition unit configured to acquire priority identification information from a storage medium to which the priority identification information is assigned when at least one load is connected. the device determines the priority of the outlet for each of the plurality of outlets based on the priority identification information acquired by the acquisition unit.
Inventor(s): Yasuhiro NAKADA of Wako-shi (JP) for honda motor co., ltd., Takayuki ENOMOTO of Wako-shi (JP) for honda motor co., ltd.
IPC Code(s): H02J3/46, H02J13/00
CPC Code(s): H02J3/46
Abstract: a control device capable of communicating with a plurality of distributed power sources in a power supply system that supplies electric power to a demander, the control device performs: acquiring capability information regarding a capability of power supply of a first distributed power source and supply power information regarding a power amount being supplied by the first distributed power source from the first distributed power source out of the plurality of distributed power sources; determining a target value of electric power supplied by the first distributed power source on the basis of the acquired capability information; and controlling electric power supplied by the first distributed power source on the basis of the determined target value and the acquired supply power information.
Inventor(s): Daiki Suetsugu of Wako-shi (JP) for honda motor co., ltd.
IPC Code(s): H02K3/26, H02K21/14
CPC Code(s): H02K3/26
Abstract: a board laminate includes a plurality of strip-shaped flexible circuit boards bent into a cylindrical shape and stacked in a radial direction of the cylinder. each of a plurality of the flexible circuit boards includes a continuous wire formed by a plurality of partial wires formed on each of two main surfaces of a strip-shaped insulating sheet and formed on each main surface are alternately connected in cascade via vias. the continuous wire has crossings in a chain-like shape without electrical continuity with each other in a projection plan view seen in a normal direction of the main surface of the insulating sheet, to form a plurality of annular portions. in a plurality of the flexible circuit boards, the flexible circuit board has a longer length of the insulating sheet as the flexible circuit board is placed further from a central axis of the cylinder.
Inventor(s): Kimitoshi Fujishita of Wako-shi (JP) for honda motor co., ltd., Daiki Suetsugu of Wako-shi (JP) for honda motor co., ltd.
IPC Code(s): H05K1/02, H02K1/12, H02K1/22
CPC Code(s): H05K1/0277
Abstract: a board laminate includes a plurality of strip-shaped flexible circuit boards bent into a cylindrical shape and stacked in a radial direction of the cylinder. each of a plurality of the flexible circuit boards includes a strip-shaped insulating sheet, a plurality of partial wires formed on each of two main surfaces of the insulating sheet, and protrusions placed on long sides extending in a longitudinal direction of the strip-shaped insulating sheet. when a plurality of flexible circuit boards are stacked together so that positions of their protrusions are aligned, the protrusions are each provided at a position where the partial wires corresponding among a plurality of flexible circuit boards are to be stacked together.
Inventor(s): Daiki Suetsugu of Wako-shi (JP) for honda motor co., ltd.
IPC Code(s): H05K1/11, H02K1/12, H02K1/22, H05K1/02
CPC Code(s): H05K1/118
Abstract: a flexible circuit board includes at least one continuous wire where first and second partial wires and second partial wires respectively formed on first and second main surfaces of a strip-shaped insulating sheet are connected alternately via vias and which includes first and second continuous portions that cross in a chain-like shape to form annular portions without electrical continuity to each other in a projection plan view seen in a normal direction of a main surface of the insulating sheet. two ends of each first and second partial wires are respectively placed along two long sides of the insulating sheet. each via is placed on a connection conductor portion that extends from each of ends of the first partial wires and ends of the second partial wires that overlap with the insulating sheet interposed therebetween toward a closer long side of the two long sides.
HONDA MOTOR CO., LTD. patent applications on January 2nd, 2025
- HONDA MOTOR CO., LTD.
- B60R13/00
- CPC B60R13/005
- Honda motor co., ltd.
- B60R21/20
- CPC B60R21/20
- B60S1/34
- B60S1/38
- B60S1/52
- CPC B60S1/3479
- B60W30/16
- B60W50/10
- G06V20/59
- CPC B60W30/162
- B62J27/20
- A41D13/05
- B62J1/00
- CPC B62J27/20
- C08J11/08
- B01D19/00
- B01D21/26
- B01F23/53
- B01F23/80
- B01F35/21
- B01F35/212
- B01F35/221
- B01F35/222
- B01F35/71
- B01F35/92
- B01F101/00
- B29B17/02
- B29K77/00
- B29K105/16
- B29K509/08
- CPC C08J11/08
- C08J11/14
- CPC C08J11/14
- G07C5/08
- CPC G07C5/0816
- G08G1/01
- G06F21/62
- CPC G08G1/0129
- H01M4/38
- H01M4/02
- H01M4/04
- H01M4/66
- H01M10/0525
- CPC H01M4/382
- H02J3/06
- H02J3/14
- H02J3/32
- H02J3/46
- H02M7/48
- CPC H02J3/06
- H02J13/00
- CPC H02J3/144
- CPC H02J3/46
- H02K3/26
- H02K21/14
- CPC H02K3/26
- H05K1/02
- H02K1/12
- H02K1/22
- CPC H05K1/0277
- H05K1/11
- CPC H05K1/118
- B60R21/207