Gm global technology operations llc (20250140704). MULTIMODULE PACKAGE FOR MULTILEVEL INVERTER
MULTIMODULE PACKAGE FOR MULTILEVEL INVERTER
Organization Name
gm global technology operations llc
Inventor(s)
Chandra S. Namuduri of Troy MI US
Junghoon Kim of Carlisle OH US
MULTIMODULE PACKAGE FOR MULTILEVEL INVERTER
This abstract first appeared for US patent application 20250140704 titled 'MULTIMODULE PACKAGE FOR MULTILEVEL INVERTER
Original Abstract Submitted
a power module and a multi-level inverter package is disclosed. at least four conductive traces are disposed on a substrate. each conductive trace includes an insulation board, a gate bus disposed on the insulation board, a kelvin bus disposed on the insulation board, and a semiconductor die operating as a transistor. the semiconductor die including a drain, a gate, and a source. the drain is coupled to the conductive trace. the source is coupled to the kelvin bus and to an electrical connection off of the conductive trace. the gate is coupled to the gate bus.