MULTI-SWITCH MODULE PACKAGING FOR MULTILEVEL INVERTER

Organization Name

gm global technology operations llc

Inventor(s)

Rashmi Prasad of Troy MI (US)

Chandra S. Namuduri of Troy MI (US)

Muhammad Hussain Alvi of Troy MI (US)

Junghoon Kim of ANN ARBOR MI (US)

Khorshed Mohammed Alam of Canton MI (US)

Thomas W. Nehl of Shelby Twp. MI (US)

Yilun Luo of Ann Arbor MI (US)

MULTI-SWITCH MODULE PACKAGING FOR MULTILEVEL INVERTER

This abstract first appeared for US patent application 20250015742 titled 'MULTI-SWITCH MODULE PACKAGING FOR MULTILEVEL INVERTER

Original Abstract Submitted

multi-switch module packaging for a multilevel inverter is provided. a multilevel inverter is connected to the battery. the multilevel inverter includes three levels, each of the three levels having a first module and a second module. the first module is formed on a first insulating substrate material, and the second module is formed on a second insulating substrate material separate from the first insulating substrate material. the first module includes a first switch coupled to the battery via a positive power rail, a second switch coupled to the battery via a negative power rail, and a third switch coupled to the second module. the second module includes another first switch coupled to the battery, another second switch coupled to the battery, and another third switch coupled to the first module. the first module includes four terminals and the second module includes another four terminals.