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Fabric8Labs, Inc. (20240304440). ELECTROCHEMICAL-ADDITIVE MANUFACTURING SYSTEMS WITH PROTECTED ELECTRODE ARRAYS simplified abstract

From WikiPatents

ELECTROCHEMICAL-ADDITIVE MANUFACTURING SYSTEMS WITH PROTECTED ELECTRODE ARRAYS

Organization Name

Fabric8Labs, Inc.

Inventor(s)

Ryan Nicholl of San Diego CA (US)

David Pain of Oceanside CA (US)

Andrew Edmonds of Oceanside CA (US)

Kareemullah Shaik of San Diego CA (US)

Edward White of San Diego CA (US)

ELECTROCHEMICAL-ADDITIVE MANUFACTURING SYSTEMS WITH PROTECTED ELECTRODE ARRAYS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240304440 titled 'ELECTROCHEMICAL-ADDITIVE MANUFACTURING SYSTEMS WITH PROTECTED ELECTRODE ARRAYS

The patent application describes protected electrode arrays and methods of fabricating them for use in electrochemical-additive manufacturing systems and other applications.

  • Electrode arrays can be used in electrochemical-additive manufacturing (ECAM) systems and other systems/applications.
  • A protected electrode array includes an electrode-interface circuit and an interposer bonded to the circuit using an adhesive layer.
  • The interposer base is formed from materials suitable for operating environments and includes vias aligned with the circuit's electrode connectors.
  • Interposer electrodes are deposited within the vias and electrically coupled to the electrode connectors.
  • The interposer can be bonded to the electrode-interface circuit before forming the vias, after forming the vias but before depositing the interposer electrodes, or after depositing the interposer electrodes within the vias.

Potential Applications: - Electrochemical-additive manufacturing systems - Electronics manufacturing - Medical devices - Aerospace components

Problems Solved: - Improved electrical connectivity in electrode arrays - Protection of electrode arrays in harsh operating environments - Enhanced reliability and performance of electronic systems

Benefits: - Increased efficiency in manufacturing processes - Higher quality and reliability of electronic components - Extended lifespan of electrode arrays - Enhanced performance in various applications

Commercial Applications: Title: Advanced Electrode Arrays for Manufacturing and Electronics This technology can be utilized in various industries such as electronics manufacturing, medical device production, aerospace engineering, and research institutions for advanced electronic systems development.

Questions about Advanced Electrode Arrays: 1. How do protected electrode arrays improve the performance of electronic systems? Protected electrode arrays enhance the reliability and longevity of electronic components by providing improved electrical connectivity and protection in harsh environments.

2. What are the key features of the interposer in the electrode array fabrication process? The interposer includes vias aligned with the electrode connectors and interposer electrodes deposited within these vias to ensure electrical coupling and protection of the electrode array.


Original Abstract Submitted

described herein are protected electrode arrays and methods of fabricating thereof. such electrode arrays can be used in electrochemical-additive manufacturing (ecam) systems and other systems/applications. in some examples, a protected electrode array comprises an electrode-interface circuit and an interposer bonded to the circuit, e.g., using an adhesive layer. the interposer can include an interposer base formed from silicon, glass, and other like materials suitable for operating environments. the interposer base comprises vias, which are aligned with the circuit's electrode connectors, and interposer electrodes deposited within these vias and electrically coupled to the electrode connectors. in some examples, the interposer comprises a base cover and/or electrode covers positioned over the interposer base and the interposer electrodes, respectively. the interposer can be bonded to the electrode-interface circuit before forming the vias, after forming the vias but before depositing the interposer electrodes, or after depositing the interposer electrodes within the vias.

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