DOWA ELECTRONICS MATERIALS CO., LTD. Patent Application Trends in 2024
DOWA ELECTRONICS MATERIALS CO., LTD. Patent Filing Activity
DOWA ELECTRONICS MATERIALS CO., LTD. patent applications in 2024
Top 10 Technology Areas
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- B22F1/05 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F9/04 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F2301/255 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F2998/10 (Processes characterised by the sequence of their steps)
- B22F1/105 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F9/24 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F2009/044 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F2304/058 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F2999/00 (Aspects linked to processes or compositions used in powder metallurgy)
- C01G33/00 (Compounds of niobium)
- Count: 2 patents
- Example: [[20240228316. POWDER INCLUDING NIOBIUM COMPLEX AND LITHIUM AND PRODUCTION METHOD THEREOF, AND PRODUCTION METHOD OF LITHIUM SECONDARY BATTERY POSITIVE ELECTRODE ACTIVE MATERIAL HAVING COATED LAYER CONTAINING LITHIUM NIOBATE simplified abstract (DOWA ELECTRONICS MATERIALS CO., LTD.)]]
Emerging Technology Areas
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- H01L2933/0016 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L33/007 ({comprising nitride compounds})
- H01L33/32 (containing nitrogen)
- H01L33/40 (Materials therefor)
- H01B1/20 (Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions)
- B22F1/147 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- G03G15/0865 ({Arrangements for supplying new developer})
- G03G9/1075 (ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY (information storage based on relative movement between record carrier and transducer)
- G03G9/108 (ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY (information storage based on relative movement between record carrier and transducer)
- H01L29/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Top Inventors
- Kaori TOKUSADA (2 patents)
- Hikaru HAYASHIDA (2 patents)
- Masahiro YOSHIDA (2 patents)
- Hidefumi FUJITA (2 patents)
- Koji TANOUE (2 patents)
- Shiori SASAKI (1 patent)
- Yoshitaka KADOWAKI (1 patent)
- Takuya KOJIMA (1 patent)
- Junji SUGIURA (1 patent)
- Shinya SASAKI (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
DOWA ELECTRONICS MATERIALS CO., LTD. Inventor States 2024 - Up to June 2024
Categories:
- Pages with broken file links
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Companies
- CPC B22F1/05
- CPC B22F1/105
- CPC B22F9/04
- CPC B22F9/24
- CPC B22F2009/044
- CPC B22F2301/255
- CPC B22F2304/058
- CPC B22F2998/10
- CPC B22F2999/00
- CPC C01G33/00
- CPC C01P2004/60
- CPC C01P2004/82
- CPC C01P2006/40
- CPC C01P2006/80
- CPC H01L33/06
- CPC H01L33/0062
- CPC H01L33/145
- CPC H01L33/30
- CPC B22F1/068
- CPC H01B1/22
- CPC B22F2009/042
- CPC B22F2009/045
- CPC B22F2304/10
- CPC H01L21/02013
- CPC H01L21/02021
- CPC H01L21/02035
- CPC H01L29/20
- CPC G03G9/108
- CPC G03G9/1075
- CPC G03G15/0865
- CPC B22F1/147
- CPC H01B1/20
- CPC H01L33/40
- CPC H01L33/32
- CPC H01L33/007
- CPC H01L2933/0016
- Patent Trends by Company in 2024