Cisco technology, inc. (20250133652). PRINTED CIRCUIT BOARD ASSEMBLY
PRINTED CIRCUIT BOARD ASSEMBLY
Organization Name
Inventor(s)
Mike Sapozhnikov of San Jose CA US
David Nozadze of San Jose CA US
Joel Richard Goergen of Soulsbyville CA US
PRINTED CIRCUIT BOARD ASSEMBLY
This abstract first appeared for US patent application 20250133652 titled 'PRINTED CIRCUIT BOARD ASSEMBLY
Original Abstract Submitted
in some embodiments, an apparatus includes a layer of a printed circuit board (pcb), a pair of signal vias formed on the layer of the pcb and including a first signal via a second signal via each configured to propagate a respective signal, a first plurality of ground vias formed on the layer and at least partially circumferentially surrounding the first signal via of the pair of signal vias, and a second plurality of ground vias formed on the layer and at least partially circumferentially surrounding the second signal via of the pair of signal vias. the first plurality of ground vias and the second plurality of ground vias include a shared ground via.
- Cisco technology, inc.
- Yuqing Zhu of Shanghai CN
- Wenbin Ma of Shanghai CN
- Mike Sapozhnikov of San Jose CA US
- Weiying Ding of Shanghai CN
- Mingjian Gao of Shanghai CN
- Mingtong Zuo of Shanghai CN
- David Nozadze of San Jose CA US
- Joel Richard Goergen of Soulsbyville CA US
- H05K1/02
- H01L21/48
- H01L23/498
- H05K3/40
- CPC H05K1/0222