Category:Yangyang Sun of San Diego CA (US)
Yangyang Sun
Yangyang Sun from San Diego CA (US) has applied for patents in technology areas such as H01L23/00 with qualcomm incorporated.
Patents
Pages in category "Yangyang Sun of San Diego CA (US)"
The following 14 pages are in this category, out of 14 total.
1
- 17819269. BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS simplified abstract (QUALCOMM Incorporated)
- 17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)
- 18155398. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (RDL) SUBSTRATE(S) WITH PHOTOSENSITIVE DIELECTRIC LAYER(S) FOR INCREASED PACKAGE RIGIDITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18177005. INTEGRATED DEVICE COMPRISING ELONGATED PADS simplified abstract (QUALCOMM Incorporated)
- 18335532. SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES (QUALCOMM Incorporated)
- 18336331. FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS (QUALCOMM Incorporated)
- 18465717. INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INNER SOLDER INTERCONNECT (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20240096845). CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract
- Qualcomm incorporated (20240243056). INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (RDL) SUBSTRATE(S) WITH PHOTOSENSITIVE DIELECTRIC LAYER(S) FOR INCREASED PACKAGE RIGIDITY, AND RELATED FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20240297129). INTEGRATED DEVICE COMPRISING ELONGATED PADS simplified abstract
- Qualcomm incorporated (20240421119). FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
- Qualcomm incorporated (20240421128). SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES
- Qualcomm incorporated (20250062285). STACKED INTEGRATED CIRCUIT DEVICES
- Qualcomm incorporated (20250087611). INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INNER SOLDER INTERCONNECT