Category:Tomotaka MORISHITA

Tomotaka MORISHITA

Executive Summary

Tomotaka MORISHITA is an inventor who has filed 1 patents. Their primary areas of innovation include {Manufacturing methods (for bumps on insulating substrates (1 patents), with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as LINTEC CORPORATION (1 patents). Their most frequent collaborators include (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L2224/11019 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• LINTEC CORPORATION: 1 patents

Collaborators

• Keisuke SHINOMIYA (1 collaborations)