Category:Swarnal BORTHAKUR of Boise ID (US)

Swarnal BORTHAKUR of Boise ID (US)

Executive Summary

Swarnal BORTHAKUR of Boise ID (US) is an inventor who has filed 3 patents. Their primary areas of innovation include {Microlenses} (2 patents), {Assemblies, i.e. Hybrid structures} (2 patents), {Interconnect structures} (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (3 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

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List of Technology Areas

• H01L27/14627 ({Microlenses}): 2 patents
• H01L27/14634 ({Assemblies, i.e. Hybrid structures}): 2 patents
• H01L27/14636 ({Interconnect structures}): 2 patents
• H01L27/14685 ({Process for coatings or optical elements}): 2 patents
• H01L27/1464 ({Back illuminated imager structures}): 1 patents
• H01L27/14621 ({Colour filter arrangements}): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/96 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05442 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/14623 ({Optical shielding}): 1 patents
• H01L27/14645 ({Colour imagers}): 1 patents

Companies

List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 3 patents

Collaborators

• Marc Allen SULFRIDGE of Boise ID (US) (2 collaborations)
• Tomas GEURTS (1 collaborations)
• Mario M. PELELLA of Mountain View CA (US) (1 collaborations)
• Chandrasekharan KOTHANDARAMAN of New York NY (US) (1 collaborations)
• Yusheng LIN of Phoenix AZ (US) (1 collaborations)
• Larry Duane KINSMAN of Redding CA (US) (1 collaborations)
• William CROFOOT of Nampa ID (US) (1 collaborations)