Shingo TERAGAWA

Executive Summary

Shingo TERAGAWA is an inventor who has filed 1 patents. Their primary areas of innovation include WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy (1 patents), WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy (1 patents), WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy (1 patents), and they have worked with companies such as DOWA Electronics Materials Co., Ltd. (1 patents). Their most frequent collaborators include (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• B22F9/04 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
• B22F1/05 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
• B22F1/147 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
• B22F2301/255 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
• B22F2304/10 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
• B22F2998/10 (Processes characterised by the sequence of their steps): 1 patents
• H01B1/20 (Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions): 1 patents

Companies

List of Companies

• DOWA Electronics Materials Co., Ltd.: 1 patents

Collaborators

• Yuma HIGASHI (1 collaborations)