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Category:Seiji TAKE

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Seiji TAKE

Executive Summary

Seiji TAKE is an inventor who has filed 3 patents. Their primary areas of innovation include by structural association with other equipment or articles (1 patents), formed by a conductive layer on an insulating support {(patch antennas (1 patents), {Optical details, e.g. printed circuits comprising integral optical means ( (1 patents), and they have worked with companies such as DAI NIPPON PRINTING CO., LTD. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

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List of Technology Areas

  • H01Q1/22 (by structural association with other equipment or articles): 1 patents
  • H01Q1/38 (formed by a conductive layer on an insulating support {(patch antennas): 1 patents
  • H05K1/0274 ({Optical details, e.g. printed circuits comprising integral optical means (): 1 patents
  • H05K3/386 (Improvement of the adhesion between the insulating substrate and the metal): 1 patents
  • H10K59/95 (ORGANIC ELECTRIC SOLID-STATE DEVICES): 1 patents
  • H05K3/067 ({Etchants}): 1 patents
  • H05K2201/09245 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H05K2201/10098 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H05K2201/10128 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H10K59/1275 (ORGANIC ELECTRIC SOLID-STATE DEVICES): 1 patents
  • H10K59/131 (ORGANIC ELECTRIC SOLID-STATE DEVICES): 1 patents
  • H05K3/4602 (Manufacturing multilayer circuits): 1 patents
  • H05K1/0298 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
  • H05K3/4652 (Manufacturing multilayer circuits): 1 patents
  • H05K2201/09781 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

List of Companies

  • DAI NIPPON PRINTING CO., LTD.: 3 patents

Collaborators

Subcategories

This category has the following 5 subcategories, out of 5 total.

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