Category:Sachiko FUJISAWA
Sachiko FUJISAWA
Executive Summary
Sachiko FUJISAWA is an inventor who has filed 5 patents. Their primary areas of innovation include Use of materials for the substrate (2 patents), ALLOYS (flints (2 patents), by powder metallurgy ( (2 patents), and they have worked with companies such as KABUSHIKI KAISHA TOSHIBA (5 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H05K1/0306 (Use of materials for the substrate): 2 patents
- C22C27/04 (ALLOYS (flints): 2 patents
- C22C1/045 (by powder metallurgy (): 2 patents
- H05K3/388 (Improvement of the adhesion between the insulating substrate and the metal): 1 patents
- H05K2203/04 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
- A61B17/34 (Trocars; Puncturing needles {(pointed biopsy instruments): 1 patents
- B21D39/023 (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire): 1 patents
- B22F3/16 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
- B22F3/24 (After-treatment of workpieces or articles {(): 1 patents
- B22F2003/248 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
- B22F2201/013 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
- B22F2301/20 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
- B22F2304/10 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy): 1 patents
- B22F2998/10 (Processes characterised by the sequence of their steps): 1 patents
- B22F2999/00 (Aspects linked to processes or compositions used in powder metallurgy): 1 patents
- A61M5/32 (DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY (introducing media into or onto the bodies of animals): 1 patents
- C22F1/18 (High-melting or refractory metals or alloys based thereon): 1 patents
- H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L23/498 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
- H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (): 1 patents
- H01L23/49866 ({characterised by the materials (materials of the substrates): 1 patents
- H01L21/4821 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
Companies
List of Companies
- KABUSHIKI KAISHA TOSHIBA: 5 patents
Collaborators
- Seiichi SUENAGA (3 collaborations)
- Hideaki BABA (2 collaborations)
- Hitoshi AOYAMA (2 collaborations)
- Daisuke FUKUSHI (2 collaborations)
- Yoichiro MORI (2 collaborations)
- Maki YONETSU (1 collaborations)
- Takashi SANO (1 collaborations)