Category:Pooya Tadayon of Portland OR (US)
Pooya Tadayon
Pooya Tadayon from Portland OR (US) has applied for patents in technology areas such as H01L23/498, H01L23/00, H01L23/538 with intel corporation.
Patents
Pages in category "Pooya Tadayon of Portland OR (US)"
The following 12 pages are in this category, out of 12 total.
1
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17949417. TECHNOLOGIES FOR A PLUGGABLE OPTICAL CONNECTOR simplified abstract (Intel Corporation)
- 18290288. HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OUTSIDE A CHIP PACKAGE simplified abstract (Intel Corporation)
- 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)
- 18615654. HYPERCHIP simplified abstract (Intel Corporation)
2
I
- Intel corporation (20240234245). SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract
- Intel corporation (20240243099). HYPERCHIP simplified abstract
- Intel corporation (20240244800). HYBRID COOLER TO THERMALLY COOL SEMICONDUCTOR DEVICES INSIDE AND OUTSIDE A CHIP PACKAGE simplified abstract
- Intel corporation (20240332100). GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20250079278). LIQUID METAL SOCKET INTERCONNECTS WITH LIQUID PASSIVATION LAYER AND FILLER MATERIALS