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Category:Mukul Renavikar of North Plains OR US

From WikiPatents

Mukul Renavikar

Mukul Renavikar from North Plains OR US has applied for patents in technology areas such as B23K35/26, B23K35/02, B23K103/08 with intel corporation.

Patents

MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SOLDER MATERIALS (20250128362)

Pages in category "Mukul Renavikar of North Plains OR US"

The following 3 pages are in this category, out of 3 total.

1

18492371. MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SOLDER MATERIALS (Intel Corporation)

2

20250218992. Core-shell Ball Grid Array M (Intel)

I

Intel corporation (20250128362). MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SOLDER MATERIALS

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