Category:Matthew P. Corbett of Mount Vernon IA (US)

Matthew P. Corbett of Mount Vernon IA (US)

Executive Summary

Matthew P. Corbett of Mount Vernon IA (US) is an inventor who has filed 2 patents. Their primary areas of innovation include Traffic control systems for aircraft {, e.g. air-traffic control [ATC]} (1 patents), for inputting data by handwriting, e.g. gesture or text (1 patents), Protection against radiation, e.g. light {or electromagnetic waves} (1 patents), and they have worked with companies such as Rockwell Collins, Inc. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• G08G5/0021 (Traffic control systems for aircraft {, e.g. air-traffic control [ATC]}): 1 patents
• G06F3/04883 (for inputting data by handwriting, e.g. gesture or text): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K2201/0715 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0723 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

List of Companies

• Rockwell Collins, Inc.: 2 patents

Collaborators

• Eric N. Anderson of Marion IA (US) (2 collaborations)
• Timothy R. Fannin of Urbana IA (US) (2 collaborations)
• Russ D. Uthe of Ely IA (US) (1 collaborations)
• Brent J Nelson of Marion IA (US) (1 collaborations)