Leah Resneck

Leah Resneck from Seattle WA US has applied for patents in technology areas such as [[:Category:{with stitch pattern (, take precedence)}|{with stitch pattern (, take precedence)}]] with Meta Platforms Technologies, LLC.

Patents

• Garment Integrated Capacitive Sensor Produced From An Insulated Knitted Layer And A Non-Insulated Knitted Layer And Uses Thereof (20250179698)

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