Category:Kyounglim Suk of Suwon-si (KR)
Kyounglim Suk
Kyounglim Suk from Suwon-si (KR) has applied for patents in technology areas such as H01L23/31, H01L21/56, H01L23/00 with samsung electronics co., ltd..
Patents
Pages in category "Kyounglim Suk of Suwon-si (KR)"
The following 13 pages are in this category, out of 13 total.
1
- 18183699. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18212939. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18319135. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18335336. PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECTS THEREIN simplified abstract (Samsung Electronics Co., Ltd.)
- 18520453. SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18530542. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18748765. SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
S
- Samsung electronics co., ltd. (20240096773). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240113001). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240186231). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240321839). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240347435). SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD simplified abstract
- Samsung electronics co., ltd. (20250079249). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE