Joshua STACEY

Joshua STACEY from Chandler AZ US has applied for patents in technology areas such as [[:Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })|the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]] with Intel Corporation.

Patents

• EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES (20250192059)

[[Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]]