Category:Jacob Ryan Vehonsky of Chandler AZ US
Jacob Ryan Vehonsky
Jacob Ryan Vehonsky from Chandler AZ US has applied for patents in technology areas such as H10D1/20, H01L23/15, H01L23/538 with intel corporation.
Patents
Pages in category "Jacob Ryan Vehonsky of Chandler AZ US"
The following 8 pages are in this category, out of 8 total.
1
- 18984426. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984438. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984444. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984454. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
I
- Intel corporation (20250120102). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125201). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125202). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250126814). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES