Category:Henning Braunisch of Phoenix AZ (US)
Henning Braunisch
Henning Braunisch from Phoenix AZ (US) has applied for patents in technology areas such as H01L23/522, H01F1/03, H01F41/16 with intel corporation.
Patents
Pages in category "Henning Braunisch of Phoenix AZ (US)"
The following 10 pages are in this category, out of 10 total.
1
- 18130582. AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18147503. SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (Intel Corporation)
- 18344695. CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS (Intel Corporation)
- 18942054. MICROELECTRONIC ASSEMBLIES (Intel Corporation)
I
- Intel corporation (20240222018). SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract
- Intel corporation (20240339381). AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract
- Intel corporation (20240355725). POWER DELIVERY STRUCTURES simplified abstract
- Intel corporation (20240429588). MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SECOND ADJACENT DIELECTRIC WAVEGUIDES HAVING DIFFERENT CORE AND/OR CLADDING MATERIALS
- Intel corporation (20250070083). MICROELECTRONIC ASSEMBLIES
- Intel corporation (20250079300). MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING