Category:Feras Eid of Chandler AZ (US)
Feras Eid
Feras Eid from Chandler AZ (US) has applied for patents in technology areas such as H01L23/522, H01F1/03, H01F41/16 with intel corporation.
Patents
Pages in category "Feras Eid of Chandler AZ (US)"
The following 12 pages are in this category, out of 12 total.
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- Intel corporation (20240203926). HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES simplified abstract
- Intel corporation (20240266745). MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract
- Intel corporation (20240274576). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240339410). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240355725). POWER DELIVERY STRUCTURES simplified abstract
- Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract
- Intel corporation (20240413031). ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Intel corporation (20240429199). METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BONDING
- Intel corporation (20250079300). MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING