Category:Dun-Nian Yaung

Dun-Nian Yaung

Executive Summary

Dun-Nian Yaung is an inventor who has filed 11 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (8 patents), Taiwan Semiconductor Manufacturing Company, Ltd (1 patents), Taiwan Semiconductor Manufacturing Company Limited (1 patents). Their most frequent collaborators include (7 collaborations), (6 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L28/91 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L28/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H10F39/014 (No explanation available): 2 patents
• H10F39/18 (No explanation available): 2 patents
• H10F39/811 (No explanation available): 2 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L27/14649 ({Infrared imagers}): 1 patents
• G02B1/002 (Optical elements characterised by the material of which they are made; Optical coatings for optical elements): 1 patents
• H01L27/14621 ({Colour filter arrangements}): 1 patents
• H01L27/14627 ({Microlenses}): 1 patents
• H01L27/14636 ({Interconnect structures}): 1 patents
• H01L27/14685 ({Process for coatings or optical elements}): 1 patents
• H01L27/1463 ({Pixel isolation structures}): 1 patents
• H01L27/14683 ({Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof (not peculiar thereto): 1 patents
• H01L21/76816 ({Aspects relating to the layout of the pattern or to the size of vias or trenches (layout of the interconnections per se): 1 patents
• H01L23/5223 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0805 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B53/10 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B53/30 (ELECTRONIC MEMORY DEVICES): 1 patents
• H04N25/79 (Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors): 1 patents
• H10F39/802 (No explanation available): 1 patents
• H10F39/8037 (No explanation available): 1 patents
• H10F39/809 (No explanation available): 1 patents
• H10F39/018 (No explanation available): 1 patents
• H10F39/807 (No explanation available): 1 patents
• H04N25/77 (Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components): 1 patents
• H10F39/80373 (No explanation available): 1 patents
• H10D1/042 (No explanation available): 1 patents
• H10D1/043 (No explanation available): 1 patents
• H10D1/716 (No explanation available): 1 patents
• H10D84/204 (No explanation available): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48157 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L28/75 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 8 patents
• Taiwan Semiconductor Manufacturing Company, Ltd: 1 patents
• Taiwan Semiconductor Manufacturing Company Limited: 1 patents
• Taiwan Semiconductor Manufacturing Company LTD: 1 patents

Collaborators

• Jen-Cheng Liu (7 collaborations)
• Hsing-Chih Lin (6 collaborations)
• Meng-Hsien Lin (3 collaborations)
• Yi-Shin Chu (2 collaborations)
• Tzu-Jui Wang (2 collaborations)
• Wei-Chih Weng (2 collaborations)
• Ko Chun Liu (2 collaborations)
• Feng-Chi Hung (2 collaborations)
• Wen-I Hsu (2 collaborations)
• Chieh-En Chen (2 collaborations)
• Chen-Hsien Lin (2 collaborations)
• Shyh-Fann Ting (2 collaborations)
• Hsiang-Lin Chen (1 collaborations)
• Cheng-Yu Huang (1 collaborations)
• Wei-Chieh Chiang (1 collaborations)
• Yen-Ting Chiang (1 collaborations)
• Yen-Yu Chen (1 collaborations)
• Kuan-Hua Lin (1 collaborations)
• Chih-Kuan Yu (1 collaborations)
• Bing Cheng You (1 collaborations)
• Hsin-Hung Chen (1 collaborations)
• Chen-Jong Wang (1 collaborations)
• Ming-Chieh Hsu (1 collaborations)
• Wei-Cheng Hsu (1 collaborations)
• Yuichiro Yamashita (1 collaborations)
• Jaio-Wei Wang (1 collaborations)
• Min-Feng Kao (1 collaborations)
• Ping-Tzu Chen (1 collaborations)