Category:Charles David Paynter of Encinitas CA (US)
Charles David Paynter
Charles David Paynter from Encinitas CA (US) has applied for patents in technology areas such as H01L23/13, H01L23/00 with qualcomm incorporated.
Patents
Pages in category "Charles David Paynter of Encinitas CA (US)"
The following 7 pages are in this category, out of 7 total.
1
- 17532754. PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17877156. PACKAGE COMPRISING INTEGRATED DEVICES simplified abstract (QUALCOMM Incorporated)
- 17878758. PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACITOR DEVICES simplified abstract (QUALCOMM Incorporated)
- 18456295. PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20240107665). PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPACITOR, AND RELATED ELECTRONIC DEVICES AND FABRICATION METHODS simplified abstract
- Qualcomm incorporated (20250062285). STACKED INTEGRATED CIRCUIT DEVICES
- Qualcomm incorporated (20250069965). PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME