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Category:CHUN-HAO CHOU

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CHUN-HAO CHOU

Executive Summary

CHUN-HAO CHOU is an inventor who has filed 3 patents. Their primary areas of innovation include Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors (1 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (1 patents), Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (1 patents), and they have worked with companies such as TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (3 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

  • H04N25/79 (Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors): 1 patents
  • H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
  • H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
  • H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
  • H10F39/8057 (No explanation available): 1 patents
  • H10F39/024 (No explanation available): 1 patents
  • H10F39/182 (No explanation available): 1 patents
  • H10F39/8023 (No explanation available): 1 patents
  • H10F39/8053 (No explanation available): 1 patents

Companies

List of Companies

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.: 3 patents

Collaborators

Subcategories

This category has the following 3 subcategories, out of 3 total.

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