Category:Brian Cronquist of Klamath Falls OR (US)

Brian Cronquist of Klamath Falls OR (US)

Executive Summary

Brian Cronquist of Klamath Falls OR (US) is an inventor who has filed 7 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), {Making of internal connections, substrate contacts} (4 patents), and they have worked with companies such as Monolithic 3D Inc. (7 patents). Their most frequent collaborators include (7 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

H10B43/20 (ELECTRONIC MEMORY DEVICES): 4 patents
H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L21/743 ({Making of internal connections, substrate contacts}): 4 patents
H01L21/76898 ({formed through a semiconductor substrate}): 4 patents
H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 4 patents
H01L2924/12032 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H10B43/40 (ELECTRONIC MEMORY DEVICES): 3 patents
H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents
H01L2924/12042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L21/76254 (Dielectric regions {, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers}): 3 patents
H10B10/00 (Static random access memory [SRAM] devices): 3 patents
H10B10/125 (ELECTRONIC MEMORY DEVICES): 3 patents
H10B12/053 (ELECTRONIC MEMORY DEVICES): 3 patents
H10B12/09 (ELECTRONIC MEMORY DEVICES): 3 patents
H10B12/50 (ELECTRONIC MEMORY DEVICES): 3 patents
H10B20/00 (Read-only memory [ROM] devices): 3 patents
H10B41/20 (ELECTRONIC MEMORY DEVICES): 3 patents
H01L2223/5442 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2223/54426 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/16145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/45124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/45147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/73253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/00011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/10253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/1301 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/1305 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/13062 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/14 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/3011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/3025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L27/0688 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L29/66621 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L29/4236 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L29/78 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L21/6835 ({using temporarily an auxiliary support}): 2 patents
G11C8/16 (Multiple access memory array, e.g. addressing one storage element via at least two independent addressing line groups): 2 patents
H01L23/5252 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H10B12/20 (ELECTRONIC MEMORY DEVICES): 2 patents
H10B20/25 (One-time programmable ROM [OTPROM] devices, e.g. using electrically-fusible links): 2 patents
H10B41/40 (ELECTRONIC MEMORY DEVICES): 2 patents
H10B41/41 (ELECTRONIC MEMORY DEVICES): 2 patents
H01L23/3677 (Cooling facilitated by shape of device {(): 2 patents
H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L24/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2221/68368 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/131 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/16146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/81005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/83894 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01002 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01004 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01018 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01019 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01046 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01068 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01077 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01078 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/01322 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/10329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/12033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/12036 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/1461 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/1579 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/16152 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/19041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/30105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H10B12/05 (ELECTRONIC MEMORY DEVICES): 2 patents
H10D10/051 (No explanation available): 2 patents
H10D30/0512 (No explanation available): 2 patents
H10D64/027 (No explanation available): 2 patents
H10D84/038 (No explanation available): 2 patents
H10D84/85 (No explanation available): 2 patents
H10D84/907 (No explanation available): 2 patents
H10D84/998 (No explanation available): 2 patents
H10D86/01 (No explanation available): 2 patents
H10D86/201 (No explanation available): 2 patents
H10D88/00 (No explanation available): 2 patents
H10D88/01 (No explanation available): 2 patents
H10D89/10 (No explanation available): 2 patents
H10B43/30 (ELECTRONIC MEMORY DEVICES): 1 patents
H10B43/50 (ELECTRONIC MEMORY DEVICES): 1 patents
H01L23/485 (consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts {(): 1 patents
H01L23/522 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L24/25 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/24146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06589 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/0002 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/01104 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/2064 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/351 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/8221 ({Three dimensional integrated circuits stacked in different levels}): 1 patents
H01L21/823828 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
H01L21/84 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L27/0207 ({Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique}): 1 patents
H01L27/11807 (Masterslice integrated circuits): 1 patents
H01L27/11898 (Masterslice integrated circuits): 1 patents
H01L27/1203 ({the substrate comprising an insulating body on a semiconductor body, e.g. SOI (three-dimensional layout): 1 patents
H01L29/66272 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/66825 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/66833 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/66901 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/7841 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/7843 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/7881 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L29/792 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L27/1214 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
H01L27/1266 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
H10D30/0411 (No explanation available): 1 patents
H10D30/0413 (No explanation available): 1 patents
H10D30/60 (No explanation available): 1 patents
H10D30/681 (No explanation available): 1 patents
H10D30/69 (No explanation available): 1 patents
H10D30/711 (No explanation available): 1 patents
H10D30/792 (No explanation available): 1 patents
H10D64/513 (No explanation available): 1 patents
H10D84/0172 (No explanation available): 1 patents
H10D86/0214 (No explanation available): 1 patents
H10D86/40 (No explanation available): 1 patents
H10D86/60 (No explanation available): 1 patents
H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/1437 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/14511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G03F9/7076 ({for microlithography (measuring printed patterns for monitoring overlay): 1 patents
G03F9/7084 ({for microlithography (measuring printed patterns for monitoring overlay): 1 patents
H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
H01L23/53214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/53228 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
H10D10/40 (No explanation available): 1 patents
H10D30/061 (No explanation available): 1 patents
H10D30/6727 (No explanation available): 1 patents
H10D30/6728 (No explanation available): 1 patents
H10D30/6733 (No explanation available): 1 patents
H10D30/6735 (No explanation available): 1 patents
H10D30/6737 (No explanation available): 1 patents
H10D30/6743 (No explanation available): 1 patents
H10D30/83 (No explanation available): 1 patents
H10D30/87 (No explanation available): 1 patents
H10D62/83 (No explanation available): 1 patents
H10D84/0186 (No explanation available): 1 patents
H01L21/268 (Bombardment with radiation {(): 1 patents
H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2223/54453 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H10D64/017 (No explanation available): 1 patents
H10D84/83 (No explanation available): 1 patents