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Category:Boon Teik Chan

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Boon Teik Chan

Executive Summary

Boon Teik Chan is an inventor who has filed 9 patents. Their primary areas of innovation include {Geometry or} layout of the interconnection structure {( (4 patents), {using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate} (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), and they have worked with companies such as IMEC VZW (9 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

  • H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 4 patents
  • H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 4 patents
  • H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
  • H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L21/76879 ({by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating (plating on semiconductors in general): 2 patents
  • H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 2 patents
  • H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
  • H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 2 patents
  • H01L21/823814 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
  • H01L21/823828 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
  • H01L21/823871 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
  • H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L21/743 ({Making of internal connections, substrate contacts}): 1 patents
  • H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
  • H01L29/41775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
  • H01L21/823864 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
  • H01L21/306 (Chemical or electrical treatment, e.g. electrolytic etching (to form insulating layers): 1 patents
  • H10B10/125 (ELECTRONIC MEMORY DEVICES): 1 patents
  • H01L29/0649 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/823418 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
  • H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
  • H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L29/41791 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

  • IMEC VZW: 9 patents

Collaborators

Subcategories

This category has the following 9 subcategories, out of 9 total.

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