Canon kabushiki kaisha (20240421117). BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
KIYOTAKA Nakamura of Tochigi (JP)
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
This abstract first appeared for US patent application 20240421117 titled 'BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
Original Abstract Submitted
a bonding apparatus including a head configured to bond a second object to a first object, a first camera configured to obtain an image by capturing the second object held by the head, and a control unit configured to determine a state of a bonding surface of the second object on a side of the first object based on an image obtained by the first camera in a state in which the second object is aligned with respect to the head, and control the head not to bond the second object held by the head to the first object if the state of the bonding surface is poor, and to bond the second object held by the head to the first object if the state of the bonding surface is excellent.