METHOD OF PRODUCING MICROSTRUCTURE AND LIQUID EJECTION HEAD

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METHOD OF PRODUCING MICROSTRUCTURE AND LIQUID EJECTION HEAD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240310729 titled 'METHOD OF PRODUCING MICROSTRUCTURE AND LIQUID EJECTION HEAD

The method described in the patent application involves producing a microstructure by forming a first resin layer of a photosensitive resin composition on a substrate, exposing it to a pattern, and then laminating a second resin layer on top of the first layer, followed by another pattern exposure.

The photosensitive resin compositions used in this method contain an epoxy resin and a photoacid generator.
Additionally, at least one of the compositions also includes a coumarone resin, with a content of less than 30 parts by mass relative to the epoxy resin content.
The process allows for the creation of intricate microstructures with precise patterns and layers.

Potential Applications: This method can be applied in the manufacturing of microelectronics, microfluidic devices, optical devices, and other micro-scale structures requiring high precision.

Problems Solved: This technology addresses the need for a method to produce complex microstructures with multiple layers and precise patterns efficiently.

Benefits: The method offers a cost-effective and reliable way to create intricate microstructures with high accuracy and resolution.

Commercial Applications: The technology can be utilized in industries such as semiconductor manufacturing, biomedical engineering, and telecommunications for the production of advanced microdevices.

Questions about the Method: 1. How does the inclusion of a coumarone resin in the photosensitive resin compositions impact the final microstructure? 2. What are the potential challenges in scaling up this method for mass production in industrial settings?

Original Abstract Submitted

provided is a method of producing a microstructure including: forming a first resin layer formed of a photosensitive resin composition (1) on a substrate, followed by pattern exposure; and laminating a second resin layer formed of a photosensitive resin composition (2) on the first resin layer having been subjected to the pattern exposure, followed by pattern exposure, wherein the photosensitive resin composition (1) and the photosensitive resin composition (2) each contain an epoxy resin and a photoacid generator, wherein at least one of the photosensitive resin composition (1) or the photosensitive resin composition (2) further contains a coumarone resin, and wherein a content of the coumarone resin is less than 30 parts by mass with respect to 100 parts by mass of a content of each of the epoxy resin of the photosensitive resin composition (1) and the epoxy resin of the photosensitive resin composition (2).