IMAGE PICKUP APPARATUS WITH HIGH HEAT DISSIPATION PERFORMANCE

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IMAGE PICKUP APPARATUS WITH HIGH HEAT DISSIPATION PERFORMANCE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240205525 titled 'IMAGE PICKUP APPARATUS WITH HIGH HEAT DISSIPATION PERFORMANCE

The abstract describes an image pickup apparatus with high heat dissipation performance. The apparatus includes a board with an image pickup device, a sheet metal member close to the front surface side of the board, an electronic component board closer to the back surface side, and a battery chamber near the outer edge of the board. The sheet metal member is thermally connected to the board and includes an arm extending towards the back surface side in the optical axis direction.

The image pickup apparatus has a board with an image pickup device.
A sheet metal member is positioned close to the front surface side of the board.
An electronic component board is located closer to the back surface side of the board.
A battery chamber is situated near the outer edge of the board.
The sheet metal member is thermally connected to the board and includes an arm extending towards the back surface side.

Potential Applications: - Surveillance cameras - Medical imaging devices - Automotive cameras

Problems Solved: - Improved heat dissipation in image pickup devices - Enhanced performance in high-temperature environments

Benefits: - Increased longevity of image pickup devices - Improved image quality in challenging conditions

Commercial Applications: Title: Enhanced Heat Dissipation Image Pickup Apparatus for Surveillance Cameras This technology can be used in surveillance cameras for improved performance in various environments, leading to better security monitoring capabilities.

Questions about the technology: 1. How does the sheet metal member contribute to the heat dissipation performance of the image pickup apparatus? 2. What are the potential market implications of this innovation in the field of medical imaging devices?

Original Abstract Submitted

an image pickup apparatus having high heat dissipation performance. the image pickup apparatus comprises a board having an image pickup device, a sheet metal member disposed closer to a front surface side than the board and adjacent to the board in an optical axis direction, an electronic component board disposed closer to a back surface side than the board, and a battery chamber disposed near an outer edge of the board. the sheet metal member is thermally connected to the board, and includes an arm, which is formed integrally with and made of the same material with the sheet metal member. the arm extends in the optical axis direction toward the back surface side, to a position closer to the back surface side than the board, and is disposed at a position closer to the optical axis than the battery chamber.